Speaker Module Anti-Overflow Structure for Damping Molding
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Solution Overview
Problem
The existing speaker modules in mobile electronic devices suffer from damping material overflow during the molding process due to clearance between the magnetic circuit structure and the molded jig, leading to reduced vibration space and impaired performance.
Innovation Solution
A speaker module design featuring an anti-overflow layer on the upper clamping plate and a flexible damping structure, which prevents damping materials from overflowing by compensating for the clearance, ensuring the vibration space and improving the speaker's performance without additional parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a damping structure is provided with shock resistance enhancement, then reliability of speakers is improved, but clearance between magnetic circuit structure and molded jig causes damping materials to overflow
Solution Approach 1:
An anti-overflow layer is introduced as an intermediary component between the upper clamping plate and the damping structure. This layer fills the clearance gap caused by tolerance accumulation, preventing damping material overflow while maintaining the shock resistance function of the damping structure.
Solution Approach 2:
The anti-overflow layer changes the physical parameters of the interface between the magnetic circuit structure and the molded jig. By adding this layer with specific thickness and material properties, the clearance gap is compensated, transforming the overflow problem into a controlled interface condition.
2Manufacturing precision
If anti-overflow layer is added to prevent damping material overflow, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The anti-overflow layer is integrated with the upper clamping plate through positioning structures (positioning holes and positioning protrusions). This merging approach ensures the anti-overflow layer remains in place during molding without requiring separate mounting mechanisms, thereby minimizing the increase in device complexity.
Solution Approach 2:
The anti-overflow layer serves multiple functions simultaneously: it prevents material overflow, compensates for clearance gaps, and provides structural support during the molding process. This self-service capability reduces the need for additional dedicated components, limiting the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The anti-overflow layer effectively prevents damping material overflow, maintaining the vibration space and enhancing speaker performance while reducing production costs and complexity.
Implementation Method 1
the anti-overflow layer is configured to prevent raw materials of the damping structure from overflowing in a molding process
Data Source
AI summary
A speaker module is provided, including a mounting frame, a damping structure, and a speaker assembly. The damping structure is disposed on the mounting frame. The speaker assembly includes a vibration system and a magnetic circuit system, the magnetic circuit system is configured to drive the vibration system to vibrate, the magnetic circuit system includes an upper clamping plate and an anti-overflow layer, the upper clamping plate is disposed on a top portion of the damping structure, the anti-overflow layer is disposed on a surface of the first main body around a perimeter of the first platform, and the anti-overflow layer is configured to prevent raw materials of the damping structure from overflowing in a molding process. No additional part is needed for mounting the anti-overflow layer, which is simple and efficient in implementation and further low in production cost.