Speaker Box Metal Embedding Member Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation devices in mobile phones face challenges in efficiently managing heat generated by components like CPUs and batteries, affecting circuit layout and antenna performance due to limitations in housing materials.
Innovation Solution
A heat dissipation device incorporating a speaker box with a metal embedding member, a heating element, and a heat conductor that utilizes air cooling by creating a high-speed airflow through the speaker unit's diaphragm, transferring heat from the heating element to the metal embedding member and out through sound outlet holes, combining convective heat exchange with liquid cooling if applicable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional housing materials are used for heat dissipation, then the housing structure is simple, but the heat dissipation efficiency is insufficient and affects circuit layout or antenna performance
Solution Approach 1:
The patent combines the speaker box structure with heat dissipation functions by embedding a metal member within the housing that serves both as a structural component and a heat conduction path. The metal embedding member is integrated into the housing structure, merging the speaker mounting function with thermal management functionality.
Solution Approach 2:
The metal embedding member serves multiple functions: it provides structural reinforcement for the speaker unit, acts as a heat conduction path from the heating element to the housing, and serves as a mounting structure for the speaker. This multi-functionality improves heat dissipation without proportionally increasing device complexity.
2Temperature
If a metal embedding member is added to the housing for heat dissipation, then heat dissipation efficiency is improved, but the manufacturing complexity increases
Solution Approach 1:
The metal embedding member is nested within the housing structure, with the speaker unit accommodated within the housing and the metal member embedded in the housing. This nested arrangement allows the heat dissipation component to be integrated within existing structural boundaries, reducing the need for additional external components.
3Temperature
If air cooling is used through the speaker unit, then heat dissipation efficiency is improved, but the speaker performance may be affected
Solution Approach 1:
The patent applies local quality by creating specific airflow paths through the housing structure with dedicated channels that guide air flow for heat dissipation purposes. The housing includes through-holes and channels positioned to facilitate convective heat transfer without interfering with the speaker diaphragm's vibration and sound production areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by leveraging air cooling and potential liquid cooling, effectively managing heat without compromising circuit layout or antenna performance, thus improving overall thermal management in mobile devices.
Implementation Method 1
the heat conductor transfers the heat generated by the heating element to the metal embedding member
Implementation Method 2
the metal embedding member conducts the heat to the front cavity and out of the sound outlet hole through the air in the front cavity
Data Source
AI summary
The present invention provides a heat dissipation device having a speaker box, a heating element and a heat conductor. The speaker box includes a housing having a sound outlet hole and a metal embedding member embedded in the housing. The speaker unit includes a diaphragm. The heat conductor is connected to the heating element. In the present invention, the heat conductor transfers the heat generated by the heating element to the metal embedding member, the metal embedding member conducts heat to the outside of the sound outlet hole through the air in the front cavity.