Speaker Diaphragm Assembly with Multi-Level Damper
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Solution Overview
Problem
Conventional speakers face challenges in maintaining thinness while preventing damper contact with underlying components during high power output, which affects acoustic performance and increases thickness.
Innovation Solution
The speaker design features a diaphragm assembly with a damper and surround disposed at different horizontal levels on the basket, and a conductor on the damper's bottom surface, allowing for pre-manufactured assembly and reducing the need for voice coil height, thus minimizing thickness and preventing excessive damper movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the voice coil height is increased to prevent damper contact with underlying components during high power output, then the damper contact problem is solved, but the total thickness of the speaker is significantly increased
Solution Approach 1:
The damper is positioned at a different horizontal level than the surround, creating a multi-level structure. This spatial reconfiguration allows the damper to be elevated without increasing the overall vertical thickness of the speaker, resolving the contradiction between preventing damper contact and maintaining thin profile.
Solution Approach 2:
The speaker components are divided into different horizontal levels: the surround is positioned at one level while the damper is positioned at a higher horizontal level on the basket. This segmentation allows independent optimization of each component's position to prevent contact while maintaining compact overall dimensions.
2Reliability
If the diaphragm is moved upward and voice coil height is increased to overcome damper contact problem, then the damper contact issue is resolved, but assembly complexity increases
Solution Approach 1:
The diaphragm assembly is pre-manufactured as an integrated unit with the damper, surround, and conductor already connected. This preliminary assembly simplifies the final speaker assembly process, as the pre-assembled unit can be installed as a single component rather than assembling multiple separate parts.
Solution Approach 2:
The damper, surround, and conductor are merged into a single integrated diaphragm assembly. This combination reduces the number of separate components and assembly steps, simplifying the overall assembly process while maintaining the functional benefits of each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances assembly convenience, maintains acoustic performance, reduces speaker thickness, and allows for increased excursion length, facilitating low-frequency design without damper contact issues.
Implementation Method 1
Audio-frequency power can enable a diaphragm (e.g., a paper cone or a film) of the speaker to vibrate and resonate with the surrounding air to form a sound through electromagnetic, piezoelectric, or electrostatic effects.
Implementation Method 2
Audio-frequency power can enable a diaphragm (e.g., a paper cone or a film) of the speaker to vibrate and resonate with the surrounding air to form a sound
Data Source
AI summary
A speaker includes a basket and a diaphragm assembly. The diaphragm assembly is located on the basket, and has a diaphragm, a damper, a surround, and a conductor. An inner edge and an outer edge of the damper are respectively connected to a bottom surface of the diaphragm and the basket. The surround and the damper are disposed on the basket and at different horizontal levels. The conductor is located on a bottom surface of the damper. The diaphragm assembly can be pre-manufactured to improve the convenience of assembling the speaker. Moreover, the damper does not move up and down exceedingly along with the voice coil, thereby preventing the damper from contacting underlying components. In addition, the total thickness of the speaker can be reduced, which facilitates thinning requirements. Alternatively, an excursion length can be increased, which facilitates the low frequency design of the speaker.