Speaker Heat Radiating Structure for Electronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic devices face heat management issues due to heat generation by speakers, leading to potential damage and reduced sound quality, as excessive heat can cause deformation and restrict sound output.
Innovation Solution
A heat radiating structure is implemented in electronic devices, featuring a housing with a front plate, rear plate, and side member, including through-holes, a middle plate, and a speaker structure with thermal interface materials and metal plates to efficiently transfer and dissipate heat generated by the speaker.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the intensity of current applied to the coil is reduced to solve heat emission problem, then heat generation is reduced, but the output of the sound of the speaker is restricted
Solution Approach 1:
The patent extracts the heat dissipation function from the speaker assembly by introducing a separate heat radiating structure. The coil is positioned adjacent to a heat radiating plate that conducts heat away from the coil, allowing the speaker to maintain high current for sound output while the heat is separately managed and dissipated to the external environment.
Solution Approach 2:
The heat radiating plate acts as an intermediary between the heat-generating coil and the housing. This intermediate structure provides a dedicated thermal conduction path, allowing heat to be transferred from the coil through the plate to the housing, thereby decoupling the thermal management from the acoustic performance requirements.
2Reliability
If heat is excessively generated by the speaker, then the current intensity must be restricted, but the output of the sound is restricted
Solution Approach 1:
The heat dissipation function is extracted from the speaker assembly by introducing a separate heat radiating structure. The coil is positioned adjacent to a heat radiating plate that conducts heat away from the coil, allowing the speaker to maintain high current for sound output while the heat is separately managed and dissipated to the external environment.
Solution Approach 2:
The heat radiating plate acts as an intermediary between the heat-generating coil and the housing. This intermediate structure provides a dedicated thermal conduction path, allowing heat to be transferred from the coil through the plate to the housing, thereby decoupling the thermal management from the acoustic performance requirements.
3Temperature
If a heat radiating structure is implemented, then heat is effectively dispersed, but the device complexity increases
Solution Approach 1:
The heat radiating plate is merged with the existing housing structure, and the coil is positioned to utilize the housing itself as part of the heat dissipation pathway. This integration approach adds minimal structural elements while achieving effective heat dissipation, reducing the overall complexity compared to separate dedicated heat sinks.
Solution Approach 2:
The housing serves dual functions: as the structural enclosure and as a heat dissipation component. The heat radiating plate and housing work together to provide both mechanical support and thermal management, eliminating the need for separate dedicated heat dissipation components and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat radiating structure effectively disperses heat away from the speaker, preventing hot spots and ensuring sound quality by promptly dissipating heat, thus protecting the device and maintaining performance.
Implementation Method 1
a thermal interface material (TIM) located between the metal plate and the yoke while contacting the metal plate and the yoke
Implementation Method 2
a heat radiating structure configured to transfer heat generated by the speaker to the housing
Implementation Method 3
a side member surrounding a space between the front plate and the rear plate, the side member including at least one through-hole
Data Source
AI summary
An electronic device according to various embodiments of the present invention may comprise: a housing including a front plate, a rear plate oriented in a direction opposite to the front plate, and a side member for surrounding a space between the front plate and the rear plate; a display exposed to the outside through the front plate, wherein the side member includes at least one through hole; a middle plate disposed between the display and the rear plate and including a surface oriented toward the rear plate; and a speaker structure disposed in the space which is adjacent to the through hole and is disposed between the middle plate and the rear plate, wherein the speaker structure includes: a metal plate attached to the surface of the middle plate; a yoke disposed apart from the metal plate toward the rear plate; a heat conducting member (TIM) disposed between and in contact with the metal plate and the yoke; and a vibration plate disposed apart from the yoke toward the rear plate; and a magnet disposed between the yoke and the vibration plate. Various other embodiments may also be possible.