Speaker Holder With Through Holes To Prevent Diaphragm Molding Contamination
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Solution Overview
Problem
During the molding of a speaker device's diaphragm, material underflow contaminates the connection part between the holder and the elastic conductive assembly, leading to unstable gluing and reduced reliability.
Innovation Solution
The speaker device design includes a holder with side walls featuring opening portions and first through holes, allowing material to flow into these holes, preventing contamination and enhancing the adhesive force between the diaphragm and holder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the holder structure is designed without opening portions and through holes, then the manufacturing process is simpler, but material underflow occurs during diaphragm molding contaminating the connection part
Solution Approach 1:
The holder structure is designed in advance with opening portions and first through holes at specific locations before the diaphragm molding process. These pre-designed features guide the material flow during molding, preventing underflow contamination of the connection part between the holder and elastic conductive assembly.
Solution Approach 2:
The holder structure incorporates opening portions and through holes that create a controlled porous-like pathway for material flow. This allows the molding material to flow through designated paths into the first through holes rather than contaminating the connection interfaces, effectively using structural porosity to control material distribution.
2Strength
If the holder structure is designed without opening portions and through holes, then the device complexity is lower, but the adhesive force between holder and diaphragm is insufficient
Solution Approach 1:
The holder is pre-designed with opening portions and first through holes that facilitate better adhesive bonding. During assembly, the diaphragm material flows into these pre-formed holes, creating mechanical interlocking and increased surface area for adhesion between the holder and diaphragm, thereby strengthening the connection.
Solution Approach 2:
The diaphragm structure nests into the holder through the first through holes, creating a nested configuration where the diaphragm is partially accommodated within the holder's opening portions. This nesting action enhances the adhesive force by creating mechanical interlocking between the two components.
3Ease of manufacture
If material flows freely during molding, then the molding process is easier, but material underflow contaminates the connection part
Solution Approach 1:
The holder structure incorporates opening portions and first through holes that create a controlled porous-like pathway for material flow. This allows the molding material to flow through designated paths rather than freely flowing, preventing underflow contamination of the connection part while maintaining ease of molding.
Solution Approach 2:
The first through holes act as intermediary channels that mediate between the molding material flow and the connection part. Material flows through these intermediary holes in a controlled manner, preventing direct contamination of the connection interface while still allowing sufficient material flow for easy molding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents material underflow and contamination, stabilizing the gluing connection between the holder and elastic conductive assembly, thereby improving the reliability and performance of the speaker device.
Implementation Method 1
a voice coil inserted into a magnetic gap to drive the diaphragm to vibrate
Implementation Method 2
an elastic conductive assembly connected to a side of the holder away from the diaphragm
Data Source
AI summary
The present disclosure provides speaker device. speaker device includes frame, vibration unit fixed to frame and magnetic circuit unit fixed to the frame and driving vibration unit to vibrate and produce sound, where magnetic circuit unit is provided with magnetic gap; vibration unit includes diaphragm fixed to frame, holder fixed to diaphragm; holder includes bottom wall that is fixed to diaphragm and provided with pair of long edges and pair of short edges, and pair of side walls bending and extending from outer peripheries of pair of short edges of bottom wall to magnetic circuit unit; The disclosure effectively solves problem of material underflow during molding of diaphragm of speaker device. In this way, connection parts between side walls and elastic conductive assembly are prevented from being contaminated, thereby reducing risk of unstable gluing between side walls and elastic conductive assembly.