Speaker Device Hot-Melt Bracket for Structural Strength
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Solution Overview
Problem
Current waterproof speaker designs face issues with poor overall structural strength and drop resistance due to independent and poorly combined sealed waterproof and speaker structures, leading to high manufacturing costs and inadequate bonding of magnetic and vibration structures with simple adhesives.
Innovation Solution
The speaker device incorporates a magnetic guiding plate, magnetic circuit module, and vibration module, where the vibration module's bracket is directly fixed to the magnetic guiding plate using a hot-melt method, enhancing structural strength and drop resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the sealed waterproof structure and speaker structure are designed independently, then the manufacturing flexibility is improved, but the overall waterproof performance deteriorates
Solution Approach 1:
The patent merges the sealed waterproof structure and speaker structure into a unified integrated structure. The waterproof seal is directly formed as part of the speaker assembly, eliminating the need for separate waterproof structures while maintaining both manufacturing efficiency and waterproof reliability.
2Adaptability or versatility
If the sealed waterproof structure and speaker structure are designed independently, then the design flexibility is improved, but the manufacturing cost increases
Solution Approach 1:
By combining the waterproof seal and speaker structure into one integrated component, the patent reduces the total number of parts and assembly steps. This integration maintains design flexibility while significantly reducing manufacturing costs through simplified production processes and reduced assembly complexity.
3Ease of manufacture
If the magnetic circuit structure and vibration structure are bonded with simple adhesives, then the manufacturing simplicity is improved, but the anti-drop effect deteriorates
Solution Approach 1:
The patent segments the speaker structure into modular components (magnetic circuit structure and vibration structure) that are precisely positioned and then bonded. This segmentation allows for simple adhesive bonding while ensuring proper alignment and distribution of bonding stress, thereby improving drop resistance without sacrificing manufacturing simplicity.
4Device complexity
If only part of the speaker device structure is bonded with glue, then the manufacturing complexity is reduced, but the overall structural strength deteriorates
Solution Approach 1:
The patent employs preliminary positioning features (such as positioning protrusions and recesses) that are pre-formed on the speaker components. These features ensure correct alignment before bonding, allowing for simplified adhesive application processes while achieving strong overall structural bonding. The preliminary positioning action prevents misalignment and ensures optimal bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly enhances the structural strength and drop resistance of the speaker device, improving its overall waterproof performance and reducing manufacturing costs by providing a more robust and integrated assembly.
Implementation Method 1
directly fixes the structure of the vibration module to the magnetic guiding plate through a hot-melt method
Data Source
AI summary
A speaker device comprising a magnetic guiding plate, a magnetic circuit module and a vibration module is disclosed. The magnetic circuit module includes a main magnet and an auxiliary magnet disposed on the magnetic guiding plate, wherein the auxiliary magnet is disposed outside the main magnet. The vibration module includes a bracket, a vibration component and a voice coil, wherein the bracket includes a frame body and multiple hot melting pillars, the frame body is disposed on the auxiliary magnet, each of the multiple hot melting pillars has one end extending downward and passing through the magnetic guiding plate from the frame body and fixed on the magnetic guiding plate, the vibration component is disposed on the frame body, the vibration component is disposed on the magnetic circuit module, and the voice coil is disposed under the vibration component and between the main magnet and the auxiliary magnet.