Speaker Module Housing Assembly for Simpler Acoustic Integration
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Solution Overview
Problem
The existing speaker module assembly process is complex and costly, involving two separate processes that complicate operations.
Innovation Solution
A speaker module design that integrates the assembly of a speaker monomer and module into a single process, utilizing a housing with a frame, upper and lower cover plates, and a magnetic circuit system, along with a simplified assembly method that includes assembling the upper cover plate, vibrating diaphragm, and voice coil on the frame, followed by the magnetic bowl and steel assembly, and finally covering the lower cover plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the speaker module is assembled in two separate processes (first assembling speaker monomer, then assembling speaker module), then the assembly can be systematically organized, but the operation becomes greatly difficult and cost increases
Solution Approach 1:
The patent merges the assembly of the speaker monomer and speaker module into a single integrated process. The frame is designed with integrated structures including the side wall, sound cavities, and mounting positions for all components. The upper and lower cover plates are configured to directly assemble with the frame in one operation, eliminating the need for separate assembly steps and reducing operational difficulty while maintaining systematic organization.
2Reliability
If the upper cover plate and lower cover plate are designed to cover opposite sides of the frame, then the housing structure is complete and protective, but the assembly precision requirement increases
Solution Approach 1:
The upper cover plate and lower cover plate are designed with asymmetric configurations relative to the frame. The side wall includes specific structural features such as the first end surface, first groove, second groove, and supporting wall that create asymmetric mounting positions. This asymmetric design provides unique positioning features for each cover plate, ensuring proper alignment and reducing assembly precision requirements while maintaining housing integrity.
3Manufacturing precision
If the magnetic steel assembly is disposed on the magnetic bowl with a magnetic gap, then the voice coil can be properly positioned, but the structural complexity increases
Solution Approach 1:
The magnetic circuit system is segmented into distinct functional components: the magnetic bowl, the magnetic steel assembly, and the voice coil positioning structure. The magnetic steel assembly is disposed on the magnetic bowl with a defined magnetic gap, creating separate but coordinated elements. This segmentation allows each component to be manufactured and positioned independently, improving voice coil positioning precision while managing structural complexity through modular design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration simplifies the assembly process, reduces processing difficulty and cost, enhances leakproofness, and improves acoustic performance by balancing air pressure between sound cavities.
Implementation Method 1
The voice coil is connected to the vibrating diaphragm for driving the vibrating diaphragm to vibrate
Implementation Method 2
The magnetic steel assembly is disposed on the magnetic bowl, a magnetic gap is formed in the magnetic steel assembly, and the voice coil is inserted into the magnetic gap
Data Source
AI summary
A speaker module and an assembling method of the speaker module includes a housing, a vibration system, and a magnetic circuit system. An accommodation space is defined in the housing, and the vibration system and the magnetic circuit system are accommodated in the accommodation space. The housing includes a frame, an upper cover plate, and a lower cover plate. The frame includes a side wall. When the upper cover plate and the lower cover plate are assembled on the frame, the frame, the upper cover plate, and the lower cover plate form an outer housing. An assembling process of the speaker module is simplified from two separate assembly processes of the speaker monomer and the speaker module into single assemble process of the speaker module, which reduces processing difficulty and cost.