Speaker Insulating Support Structure for Heat Dissipation Control
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Solution Overview
Problem
The generation of heat from speakers in electronic devices poses a challenge, necessitating effective heat dissipation solutions to maintain device performance and longevity.
Innovation Solution
An electronic device design incorporating a housing with a heat dissipation portion surrounding the speaker, a supporting member with a larger first portion on the speaker's surface and a smaller second portion facing the heat dissipation portion, and air gaps to facilitate air passage for heat transfer reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation portion is placed close to the speaker, then heat dissipation efficiency is improved, but heat transfer to the speaker increases causing thermal management issues
Solution Approach 1:
A supporting member is introduced as an intermediary component between the speaker and the heat dissipation portion. This supporting member includes an insulating structure that mediates the thermal interaction, allowing the heat dissipation portion to be positioned close to the speaker for efficient heat dissipation while preventing excessive heat transfer to the speaker through the insulating material.
Solution Approach 2:
The supporting member is segmented into distinct functional regions: a first portion with a larger area that contacts the speaker, a second portion with a smaller area that faces the heat dissipation portion, and a third portion connecting them. This segmentation allows different parts of the supporting member to serve different functions - mechanical support, thermal insulation, and structural connection - thereby resolving the contradiction between heat dissipation efficiency and heat transfer prevention.
2Strength
If the supporting member area facing the speaker is larger, then mechanical support is improved, but heat transfer to the heat dissipation portion increases
Solution Approach 1:
The supporting member exhibits local quality variations across its structure. The first portion has a larger area for optimal mechanical support and heat contact with the speaker, while the second portion has a smaller area to minimize heat transfer to the heat dissipation portion. The insulating material composition and thickness are also locally optimized to balance mechanical strength requirements with thermal insulation performance in different regions of the supporting member.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation from the speaker, improving device performance and longevity by reducing thermal buildup.
Implementation Method 1
The third portion of the supporting member may include at least one air gap configured to pass air in the enclosure to reduce heat transferred from the first portion to the second portion
Implementation Method 2
an enclosure including a heat dissipation portion facing the fourth surface of the speaker and spaced apart from the fourth surface
Implementation Method 3
a heat dissipation portion including metal facing the fourth surface of the speaker
Data Source
AI summary
An electronic device includes: a housing, a speaker, and an enclosure surrounding the speaker, the enclosure including a heat dissipation portion comprising a thermally conductive material facing the speaker and spaced apart from the speaker. The electronic device includes a support disposed between the speaker and the enclosure, the support including a first portion disposed on the speaker, a second portion facing the heat dissipation portion in the enclosure, and a third portion connecting the first portion and the second portion. An area of the first portion may be greater than an area of the second portion.