Speaker Module Integrating Conductive Element in Support Frame
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Solution Overview
Problem
The existing speaker module assembly process is complex and costly due to the need for multiple manufacturing processes of the flexible circuit board and the assembly of the speaker unit into the housing body.
Innovation Solution
A speaker module design that integrates a conductive element directly into the support frame, allowing the vibration system and magnetic circuit system to be directly installed on opposite sides of a positioning structure, eliminating the need for a separate speaker unit assembly and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible circuit board is used to lead out the housing body for connecting the speaker unit to external circuits, then electrical connection is achieved, but the manufacturing process becomes complex and costly with multiple assembly steps
Solution Approach 1:
The patent merges the support frame and conductive element into a single integrated component. The conductive element is directly formed as part of the support frame structure, eliminating the need for separate flexible circuit boards and reducing the number of assembly steps while maintaining reliable electrical connection between the speaker unit and external circuits
Solution Approach 2:
The support frame is designed to serve multiple functions simultaneously: it provides mechanical support for the speaker unit, acts as a structural component of the housing body, and serves as the conductive element for electrical connection. This multi-functionality reduces the overall number of components and simplifies the assembly process
2Stability of the object's composition
If the speaker unit is assembled separately and then installed into the housing body, then proper positioning and connection are achieved, but the assembly process requires multiple steps and increases manufacturing cost
Solution Approach 1:
The patent combines the speaker unit assembly with the housing body assembly by integrating the conductive element into the support frame. This allows the speaker unit to be directly installed into the housing body in a single assembly operation, eliminating the need for separate speaker unit assembly and subsequent installation steps, thereby improving productivity
3Reliability
If multiple manufacturing processes are used for the flexible circuit board, then electrical connection reliability is improved, but the manufacturing cost increases
Solution Approach 1:
The patent eliminates the need for separate flexible circuit board manufacturing processes by integrating the conductive element directly into the support frame. This single-integration approach reduces manufacturing complexity and cost while maintaining reliable electrical connection through the unified structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing and assembly processes, reduces costs, and enables a quicker and more convenient application of the speaker module by eliminating the need for a separate speaker unit assembly and allowing for a contact-type electrical connection with the external circuit.
Implementation Method 1
a conductive element (112) integrally injection-molded in the support frame (11); the conductive element (112) is exposed to the through cavity and exposed outside the support frame for being electrically connected to the vibration system
Data Source
AI summary
The present disclosure provides a speaker module. The speaker module includes a housing body, a vibration system, and a magnetic circuit system. The housing body includes a support frame having a through cavity, a front cover mounted on the through cavity opening side of the support frame, and a back cover mounted on the side of the support frame away from the front cover. The vibration system, the support frame and the back cover are enclosed to form a back cavity. The support frame includes an integrally injection-molded conductive element. This configuration of the present disclosure can simplify the manufacturing process of the speaker module, and reduce the application cost.