Speaker Module Mounting Structure with Segmented PCB
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Solution Overview
Problem
The existing speaker module mounting structures in electronic devices face challenges with high-frequency and low-frequency performance due to the placement of printed circuit boards, which can interfere with sound radiation and resonance spaces, and also cause issues with the mounting efficiency of adjacent hardware components.
Innovation Solution
Implementing a printed circuit board with an open loop shape that minimizes its area within the resonance space and avoids overlapping with the conduit, allowing for improved sound transmission and reduced interference with other components, while also using a sealing member to prevent sound leakage and enhance mounting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the printed circuit board is disposed to surround the speaker module in a closed loop shape, then the mounting efficiency is improved, but the high-frequency performance deteriorates due to increased conduit length
Solution Approach 1:
The printed circuit board is divided into a first portion and a second portion that are spatially separated. The first portion is disposed above the speaker module while the second portion is disposed below the speaker module, eliminating the closed loop configuration. This segmentation reduces the conduit length and allows sound waves to propagate more effectively in the high-frequency band while maintaining electrical connections to the speaker module.
2Stability of the object's composition
If the printed circuit board is disposed to surround the speaker module, then the structural stability is improved, but the low-frequency performance deteriorates due to reduced resonance space
Solution Approach 1:
The printed circuit board is segmented into separate portions disposed at different locations (above and below the speaker module) rather than forming a surrounding closed loop. This eliminates the intrusion into the resonance space while maintaining structural stability through alternative support configurations.
Solution Approach 2:
The printed circuit board transitions from a two-dimensional planar arrangement surrounding the speaker module to a three-dimensional configuration where portions are disposed at different heights (above and below). This vertical separation preserves the resonance space volume while maintaining electrical connectivity.
3Reliability
If the conduit length is increased to avoid the printed circuit board, then the high-frequency performance is improved, but the device thickness increases
Solution Approach 1:
The printed circuit board is segmented and repositioned to reduce conduit length. By placing portions above and below the speaker module rather than surrounding it, the sound radiation path is shortened, improving high-frequency performance without excessive increase in device thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances high-frequency performance by reducing conduit length and expanding the resonance space, leading to improved low-frequency performance and better integration with other hardware components within the electronic device.
Implementation Method 1
a first sealing member disposed between the rear plate and a bracket, and formed in a closed curve along an edge of the speaker module
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing comprising a front plate facing a first direction, a back plate facing a second direction that is opposite the first direction, and an outer wall which encompasses the space between the front plate and the back plate and in which a pipe passage extending to the outside is arranged, a speaker module positioned in the space, which is adjacent to the pipe passage, a printed circuit board arranged along at least a part of the side surface of the speaker module and formed along the periphery of the region between the outer wall, having the pipe passage, and the speaker module, and a first sealing member arranged between the back plate and a bracket and formed into a closed loop along the edge of the speaker module.