Speaker Mounting Structure in Slim Electronic Device
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Solution Overview
Problem
Existing speaker mounting structures in electronic devices either increase the device's thickness due to PCB surface mount structures or incur high material costs with separate FPCBs, and fail to efficiently manage production and sealing.
Innovation Solution
A speaker mounting structure that cuts a portion of the PCB to reduce height, uses contact pads on the PCB to connect the speaker, and employs microcellular urethane ribs for sealing, ensuring the speaker's thickness matches the substrate and maintaining parallel alignment without overlapping, while utilizing a support structure and rear case for assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a speaker is mounted on top of the PCB using surface mount structure, then the speaker can be connected to the PCB, but the thickness of the electronic device increases
Solution Approach 1:
The speaker is extracted from the traditional surface-mount position on top of the PCB and relocated to a cutout opening in the PCB. This extraction allows the speaker to be positioned in a different spatial location (within the opening rather than on top), thereby reducing the overall device thickness while maintaining electrical connection through contact pads at the bottom of the speaker
Solution Approach 2:
The speaker mounting approach transitions from a vertical stacking arrangement (speaker on top of PCB increasing thickness) to a planar integration approach (speaker within PCB opening with parallel alignment). The speaker's top and bottom surfaces are positioned substantially parallel to the PCB's top and bottom surfaces, utilizing the PCB's thickness dimension rather than adding to it
2Reliability
If a separate FPCB is used to mount the speaker, then the speaker can be connected to the PCB, but the material cost and production complexity increase
Solution Approach 1:
The speaker mounting function is merged directly into the PCB structure itself. Instead of using a separate FPCB as an intermediate component, the PCB incorporates both the structural support (through the opening) and the electrical connection (through contact pads formed on the PCB). This merging eliminates the need for separate FPCB manufacturing and assembly processes
Solution Approach 2:
The PCB is designed to perform multiple functions: it provides the structural framework of the device, creates the opening for speaker accommodation, forms the electrical contact pads for speaker connection, and maintains the overall device thickness. This multi-functionality eliminates the need for dedicated FPCB components that would otherwise be required solely for speaker connection
3Reliability
If the speaker is mounted in a PCB surface mount structure, then the speaker can be connected, but the mounting space is inefficient and device height increases
Solution Approach 1:
The speaker is extracted from the conventional surface-mount position where it would sit on top of the PCB, consuming vertical space. Instead, the speaker is positioned within a cutout opening in the PCB, utilizing the PCB's own volume rather than adding to it. This extraction optimizes the use of available mounting space and reduces the device's overall height
Solution Approach 2:
The speaker is nested within the PCB structure through a cutout opening. The speaker's position is integrated into the PCB's thickness dimension, with the speaker's bottom surface contacting the PCB's inner surface and the speaker's top surface aligned with or slightly below the PCB's outer surface. This nesting arrangement efficiently utilizes the PCB's volume for speaker accommodation
Data Source
AI summary
A slim electronic device is provided. The slim electronic device includes a substrate having an opening formed therein, and an audio component accommodated in the opening of the substrate without overlapping the substrate and disposed such that the top and bottom thereof are substantially parallel to the top and bottom of the substrate.