Speaker Device with Scalloped Hole for Directivity

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Solution Overview

Problem

Conventional speaker devices face challenges in achieving uniformity of piezoelectric vibrators in height and orientation, which affects the directivity of sound waves emitted.

Innovation Solution

The speaker device incorporates a substrate with a uniform thickness, featuring a vibrator layer with specific electrode layers and a hole for sound wave output, along with scallops on the inner and outer walls to enhance directivity, manufactured using semiconductor techniques to ensure uniformity in shape, size, and orientation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If piezoelectric vibrators are pressed against a support member to achieve uniformity in height and orientation, then directivity is improved, but manufacturing precision deteriorates due to variable pressing extent

Engineering Contradiction:
ImprovedirectivityVSAvoiduniformity of piezoelectric vibrators
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical pressing method with a semiconductor manufacturing process. Vibrators are formed by depositing layers (base material layer 11, first electrode layer 12, piezoelectric element layer 13, second electrode layer 14) and etching through the substrate 2 to create holes 4. This substitution eliminates variable pressing forces and achieves uniformity through controlled material deposition and removal processes, resolving the contradiction between improving directivity and maintaining manufacturing precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Device complexity

If conventional pressing methods are used to align piezoelectric vibrators, then device complexity is reduced, but manufacturing precision deteriorates due to inability to achieve micron-level uniformity

Engineering Contradiction:
Improvesimplicity of assemblyVSAvoiduniformity in shape, size, and orientation
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent merges the vibrator formation and substrate processing into a single integrated semiconductor manufacturing process. The vibrators are formed directly on the substrate through sequential deposition of layers and etching, eliminating separate assembly steps. This integration achieves micron-level uniformity in shape, size, and orientation while actually increasing device complexity in the manufacturing process, but simplifying the final structure.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in higher directivity and reduced variations in sound wave orientation and phase, leading to improved sound wave emission patterns.

Implementation Method 1

a piezoelectric element layer (13), and a second electrode layer (14), each of which has a uniform thickness, and which are layered in an order mentioned

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS10484796B2Speaker device and method for manufacturing speaker device
Publication Date: 2019.11.19 I PEX CO LTD
  • US10484796B2 patent drawing
  • US10484796B2 patent drawing
  • US10484796B2 patent drawing

AI summary

An array speaker device (1A) includes a vibrator (20) arranged on one face of a substrate having a uniform thickness, the vibrator being formed of a base material layer (11), a first electrode layer (12), a piezoelectric element layer (13), and a second electrode layer (14), each of which has a uniform thickness, and which are layered in the order mentioned on the substrate. A hole through which a sound wave is outputted in the thickness direction of the substrate is provided on the substrate at a position corresponding to the vibrator (20), the sound wave being generated by vibration of the vibrator (20) to which a voltage signal is applied via the first electrode layer (12) and the second electrode layer (14). Scallops (S) made of an indentation and a projection alternating in the thickness direction of the substrate are formed on the inner circumferential wall of the hole.