Speaker Assembly Step Structure High-Frequency Interference
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Solution Overview
Problem
Existing electronic devices face challenges in achieving optimal sound quality, particularly in the high-frequency band, due to destructive interference between progressive and reflected sound waves in the speaker assembly.
Innovation Solution
Incorporating a step structure adjacent to the area where the first portion of the supporting structure contacts the speaker cover, which adjusts the frequency of reflected sound waves and shifts the dip in sound pressure to a higher frequency band, thereby enhancing high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional speaker assembly structure is used, then the device can be manufactured with simple structure, but destructive interference between progressive and reflected sound waves causes poor high-frequency sound quality
Solution Approach 1:
The patent introduces a step structure that creates multiple reflection paths for sound waves by adding a dimensional feature (the step) to the speaker cover. This causes sound waves to reflect at different angles and paths, transforming the single-path reflection into multi-path reflection, which resolves the destructive interference issue while maintaining manufacturing simplicity
Solution Approach 2:
The step structure is placed at a specific location (adjacent to where the supporting structure contacts the speaker cover) rather than uniformly across the entire speaker assembly. This localized modification creates the desired sound wave reflection characteristics only in the critical area where interference occurs, improving high-frequency sound quality without requiring complex overall structural changes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The addition of the step structure effectively shifts the frequency band with a dip in sound pressure to a higher frequency range, thereby improving the high-frequency band performance and overall sound quality of the speaker assembly.
Implementation Method 1
adjusts the frequency of reflected sound waves
Implementation Method 2
destructive interference between progressive and reflected sound waves in the speaker assembly
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing including a first speaker hole and a speaker assembly disposed in the housing and configured to radiate a sound to an outside of the electronic device through the first speaker hole, wherein the speaker assembly includes a speaker including a diaphragm, a first speaker cover facing the diaphragm and spaced apart from the diaphragm, a sound space formed between the diaphragm and the first speaker cover, a first supporting structure including a first portion formed to surround a portion of the sound space, and a step structure disposed adjacent to an area where a portion of the first portion of the first supporting structure contacts the first speaker cover and disposed to be spaced apart from the speaker.