Speaker Module Stepped Duct Structure for High-Frequency Audio
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Solution Overview
Problem
Existing electronic devices face challenges in optimizing the design of speaker modules to enhance sound quality while efficiently utilizing limited internal space, particularly in high-frequency audio output, due to constraints in the design of the ducts and enclosures that affect sound pressure levels.
Innovation Solution
The implementation of a speaker module with a plate that contacts the printed circuit board, forming a stepped structure to expand the duct area for audio signal transmission, combined with a sealant to isolate sound pathways, enhances sound quality by improving the area for high-pitched audio signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the speaker module occupies a partial area of the printed circuit board with conventional duct design, then the internal space is utilized, but the duct area is limited which restricts high-frequency audio output quality
Solution Approach 1:
The patent transitions from a conventional planar duct layout to a three-dimensional stepped structure. The plate is formed to contact the printed circuit board at a first position and extend to a second position at a different height level, creating multiple duct areas across different vertical dimensions. This dimensional transition allows the duct area to expand without proportionally increasing the footprint area on the printed circuit board, effectively resolving the contradiction between maximizing duct area and minimizing internal space occupation.
Solution Approach 2:
The stepped structure of the plate creates nested duct areas where multiple duct passages are arranged in a compact, hierarchical configuration. The first duct area and second duct area are positioned at different height levels, allowing them to be nested within the vertical space above the printed circuit board. This nesting approach maximizes the total duct area while maintaining a compact overall structure that does not excessively occupy internal space.
2Reliability
If the duct area is expanded to improve high-frequency audio output, then sound pressure levels improve, but the internal space for other components is reduced
Solution Approach 1:
By utilizing the vertical dimension through the stepped plate structure, the patent expands duct area into the third dimension rather than spreading it out horizontally. This allows sound quality to be improved through increased duct area while maintaining a compact horizontal footprint that preserves internal space for other device components.
3Manufacturing precision
If a plate structure is added to expand duct area, then high-frequency audio transmission is improved, but the device complexity increases
Solution Approach 1:
The plate is integrated as part of the speaker module assembly, combining the structural support function with the acoustic duct function. The plate contacts the printed circuit board and simultaneously forms the stepped duct structure, merging multiple functions into a single component rather than adding separate elements, thereby limiting the increase in device complexity.
Solution Approach 2:
The plate serves multiple functions: it provides structural support, forms the duct passages for audio signal transmission, and creates the stepped configuration for optimizing acoustic flow. This multi-functionality reduces the need for additional dedicated components, thereby improving audio signal transmission without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves sound pressure levels, particularly in high-frequency ranges, by expanding the duct area and minimizing interference, thereby extending the frequency range of audio output without compromising the internal space for other components.
Implementation Method 1
combined with a sealant to isolate sound pathways
Implementation Method 2
forming a stepped structure to expand the duct area for audio signal transmission
Data Source
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AI summary
An electronic device includes a housing, a printed circuit board in the housing, a plate including a first portion in contact with one surface of the printed circuit board, a second portion spaced apart from the first portion in a direction in which another surface of the printed circuit board opposite to the one surface faces and extending toward a speaker hole and a third portion disposed between the first portion and the second portion, a speaker configured to output audio signals, and a case connected to the first portion to form a first space in which the audio signal is output from the speaker and connected to the second portion to form a second space for guiding the audio signal from the first space to the speaker hole. The second portion is stepped with respect to the first portion. In addition to this, various embodiments are possible.