Rounded Speaker Enclosure With Waveguide Heat Sink Integration
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Solution Overview
Problem
There is a challenge in designing compact electronic voice-activated devices that provide effective audible output and heat dissipation while maintaining a simple structure and low cost, especially when integrating components like speakers and heat sinks in a small form factor for smart home environments.
Innovation Solution
The implementation of a dual-purpose acoustic waveguide and heat sink within the device, which redirects sound output from internal speakers to the exterior while also serving as a heatsink to dissipate heat generated by electronic components, using materials with high thermal conduction properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the device uses a compact form factor with integrated components, then the device size is reduced, but the ability to dissipate heat effectively deteriorates
Solution Approach 1:
The patent combines the acoustic waveguide and heat sink into a single integrated component. The waveguide structure serves dual purposes: directing sound from the speaker while simultaneously functioning as a heat dissipation pathway for electronic components, thereby resolving the conflict between compact size and heat management
Solution Approach 2:
The waveguide structure is designed to perform multiple functions within the compact device: acoustic signal transmission and heat dissipation. This multi-functionality allows the device to maintain small dimensions while effectively managing both audio output and thermal generation from electronic components
2Adaptability or versatility
If the device integrates multiple components (speakers, electronics, antennas) in a compact form, then device functionality is improved, but structural complexity increases
Solution Approach 1:
The patent merges the waveguide and heat sink into one component, reducing the total number of parts needed. This integration simplifies the overall structure while maintaining the functionality of both acoustic output and thermal management in the compact device
3Reliability
If the device provides sufficient air space for speaker operation, then audible output quality is improved, but device volume increases
Solution Approach 1:
The integrated waveguide-heat sink structure provides the necessary acoustic pathway for the speaker while occupying minimal space. The waveguide efficiently directs sound from the speaker to the exterior, maintaining audio quality without requiring large internal air spaces that would increase device volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables compact voice-activated devices to provide clear and effective audible responses while efficiently managing heat, ensuring reliable operation and a sleek design that matches various home environments.
Implementation Method 1
an acoustic waveguide 434 is provided within the electronic device 404 to redirect sound output by the one or more speakers 436 from the inside to the outside of the electronic device 404
Implementation Method 2
The waveguide 434 is also configured to serve as a heatsink to dissipate to the outside of the electronic device 404 heat generated by operation of the electronic components
Implementation Method 3
using materials with high thermal conduction properties
Data Source
AI summary
This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.