Spectral Imaging Detector Stacked Photodiode Scintillator
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Solution Overview
Problem
Conventional CT scanners lack efficient integration of spectral information due to high interconnect density and large footprint caused by routing signals from double-decker detectors, which degrades signal quality and increases costs.
Innovation Solution
A one-dimensional multi-element photo detector with integrated readout electronics and a scintillator array, where photodiode and scintillator pixels are stacked, allowing for optical coupling and reduced interconnect density, enabling efficient energy separation and spectral information derivation without discarding photons.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a double-decker detector with side-mounted photosensor array is used to obtain spectral information, then spectral information can be obtained, but the footprint increases and interconnect density increases causing noise and signal degradation
Solution Approach 1:
The patent transitions from a planar side-mounted photosensor array to a three-dimensional stacked configuration where photosensors are positioned directly above or below scintillators in multiple layers. This vertical stacking in the depth dimension allows spectral information to be obtained without increasing the detector's footprint area, as multiple detection layers share the same lateral space.
Solution Approach 2:
The patent implements a nested structure where photosensor layers are positioned within or adjacent to scintillator layers in a stacked arrangement. The photosensors are optically coupled to scintillators in a nested configuration, allowing the detection system to be compact while maintaining spectral discrimination capabilities through multiple nested layers.
2Loss of information
If a double-decker detector with side-mounted photosensor array is used to obtain spectral information, then spectral information can be obtained, but interconnect density increases causing noise and signal degradation
Solution Approach 1:
The patent extracts the photosensors from the planar circuit board configuration and positions them in separate stacked layers directly coupled to scintillators. This separation removes the need for dense interconnects on a circuit board, as each photosensor layer can be directly bonded to or optically coupled with its corresponding scintillator layer, reducing interconnect density and associated noise.
Solution Approach 2:
The patent introduces optical coupling media or direct optical interfaces between scintillator layers and photosensor layers as intermediaries. This optical coupling mechanism eliminates the need for electrical interconnects to route signals between stacked layers, thereby reducing interconnect density and improving signal quality by removing electrical noise sources.
3Loss of information
If a double-decker detector with side-mounted photosensor array is used to obtain spectral information, then spectral information can be obtained, but device cost increases
Solution Approach 1:
The patent creates a multi-functional stacked detector structure where each layer serves multiple purposes: scintillators convert x-rays to light, photosensors detect the converted light, and the stacked arrangement simultaneously provides both spectral discrimination and conventional CT measurement capabilities. This multi-functionality consolidates what would otherwise require separate detector systems into a single integrated device, reducing overall cost.
Solution Approach 2:
The patent merges the spectral detection function and conventional CT measurement function into a single integrated stacked detector array. By combining multiple detection layers with different functions in one compact structure, the patent eliminates the need for separate detector systems, reducing manufacturing complexity and cost while maintaining both spectral information and conventional imaging capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the detector array's footprint and cost, increases reliability, and enhances dose efficiency by allowing energy separation without photon loss, while maintaining conventional CT measurement capabilities.
Implementation Method 1
A scintillator array includes a first upper row and a second lower row of scintillator pixels. The first upper and second lower rows of scintillator pixels are respectively optically coupled to the first upper and second lower rows of photodiode pixels.
Implementation Method 2
A one-dimensional multi-element photo detector includes a photodiode array with a first upper row of photodiode pixels and a second lower row of photodiode pixels
Implementation Method 3
lower energy photons are absorbed in upper scintillator row and higher energy photons, which traverse through the upper scintillation row, are absorbed in the lower scintillation row
Data Source
AI summary
A one-dimensional multi-element photo detector includes a photodiode array with a first upper row of photodiode pixels and a second lower row of photodiode pixels. The photodiode array is part of the photo detector. A scintillator array includes a first upper row and a second lower row of scintillator pixels. The first upper and second lower rows of scintillator pixels are respectively optically coupled to the first upper and second lower rows of photodiode pixels. The photo detector also includes readout electronics, which are also part of the photo detector. Electrical traces interconnect the photodiode pixels and the readout electronics.