Semiconductor Thin Film Spectral Noise Attenuation

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Solution Overview

Problem

Existing methods for measuring semiconductor thin film characteristics, such as thickness and Optical Critical Dimension (OCD), are hindered by noise in measurement spectra, which affects the accuracy of regression analysis models.

Innovation Solution

An analysis apparatus and method that includes a spectrum assembly to acquire and correct spectral noise and uncertainty, using a combination of machine learning and physical models to attenuate noise and improve measurement precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If regression analysis is performed using measurement spectrum, then thin film thickness and OCD can be measured, but measurement precision is degraded due to noise in the spectrum

Engineering Contradiction:
Improvemeasurement precisionVSAvoidspectral noise
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by performing noise attenuation and uncertainty correction on the measurement spectrum before regression analysis. The system evaluates uncertainty of measurement parameters and attenuates spectral noise in advance, so that when regression analysis is performed, the data is already cleaned and corrected, improving measurement precision without requiring changes to the regression analysis method itself

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary processing step between spectrum acquisition and regression analysis. This intermediary includes uncertainty evaluation and noise attenuation processes that act as a mediator to clean the spectral data before it is used for measurement, thereby isolating the regression analysis from the harmful effects of spectral noise

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20240310161A1Apparatus, system, and method for analyzing thin films with improved precision
Publication Date: 2024.09.19 AUROS TECH INC
  • US20240310161A1 patent drawing
  • US20240310161A1 patent drawing
  • US20240310161A1 patent drawing

AI summary

An analyzing apparatus is provided. The analyzing apparatus may include a spectrum unit acquiring a spectrum related to semiconductor characteristics, and a corrector provided with a model that corrects at least one of noise and uncertainty of a measurement parameter related to the spectrum. The analyzing apparatus may include an evaluator provided to evaluate the uncertainty of the parameter corresponding to a controllable factor of measurement equipment that outputs the spectrum, and an attenuator provided to attenuate the spectral noise on the basis of an uncontrollable factor of the measurement equipment.