Spectrophotometer Circuit Segmentation for Robust Sensing
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Solution Overview
Problem
Existing spectrophotometers are often overengineered, leading to high costs, complexity, fragility, and frequent calibration needs due to the use of high-performance photodiodes, amplifiers, and analog-to-digital converters, which can result in unreliable systems with differing component lifetimes, necessitating replacement of entire circuit boards upon failure.
Innovation Solution
A spectrophotometer design featuring integrated photodiode modules on printed circuit boards with separate boards for light sources and detectors, allowing for off-board control and using robust, low-cost sensors suitable for threshold sensing, and improved temperature sensing with board-mounted sensors to simplify and cost-effectively maintain the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high-performance photodiodes, amplifiers, and analog-to-digital converters are used, then measurement precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent applies this principle by using inexpensive, integrated photodiode modules with simple threshold sensing capability instead of expensive high-performance photodiodes. The system accepts that these lower-cost sensors have limited precision but are sufficient for threshold detection applications, thereby reducing overall system complexity and cost while maintaining adequate functionality for the intended purpose
Solution Approach 2:
The patent extracts the complex signal processing functions (amplification, analog-to-digital conversion, and data processing) from the sensor board and relocates them to a separate processor. This separation allows the sensor board to use simple, low-cost integrated photodiodes while the complex processing is handled externally, resolving the contradiction between measurement precision and device complexity
2Measurement precision
If high-performance photodiodes, amplifiers, and analog-to-digital converters are used, then measurement precision is improved, but reliability deteriorates due to differing component lifetimes
Solution Approach 1:
The patent segments the system into two independent parts: a sensor board containing only the integrated photodiode modules and a separate processor containing all complex electronics. This segmentation ensures that components with different lifetimes (photodiodes versus processors) are isolated from each other, so when one fails, the other remains intact and functional, thereby improving overall system reliability
Solution Approach 2:
By using inexpensive integrated photodiode modules that are designed to be replaced as a unit rather than individually replacing expensive electronic components, the system improves reliability. When the photodiodes fail, the entire sensor board can be quickly swapped out without affecting the processor or other expensive components
3Measurement precision
If high-performance photodiodes, amplifiers, and analog-to-digital converters are used, then measurement precision is improved, but ease of repair deteriorates due to necessitating replacement of entire circuit boards
Solution Approach 1:
The patent divides the system into a sensor board and a processor, allowing the sensor board to be replaced independently without affecting the processor. This segmentation makes repair easier because only the faulty component needs to be replaced, not the entire system
Solution Approach 2:
The sensor board with integrated photodiodes is designed as a disposable or easily replaceable unit. When it fails, the entire board can be quickly swapped out without complex repair procedures, improving ease of repair compared to systems where expensive electronic components are integrated into a single difficult-to-service circuit board
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design results in a more cost-effective, robust, and maintainable spectrophotometer with reduced complexity, improved reliability, and extended system lifetime by separating components with different lifespans and relocating complex processing off-board, facilitating easier replacement and calibration.
Implementation Method 1
one or more integrated photodiode modules disposed on the first printed circuit board... configured to direct light towards the one or more integrated photodiode modules through the one or more sample wells
Implementation Method 2
a first set of one or more light sources disposed on the second printed circuit board... configured to direct light towards the one or more integrated photodiode modules
Implementation Method 3
a heater block disposed between the first printed circuit board and the second printed circuit board... a heater thermally coupled to the heater block
Implementation Method 4
a first temperature sensor disposed on the first printed circuit board, where the first temperature sensor is compressed against a first surface of the heater block
Data Source
AI summary
Some aspects of the present disclosure are generally directed to spectrophotometers configured to be coupled to microfluidic sample cartridges. In some embodiments, spectrophotometers comprising less complex circuitry may lead to a more robust functionality with consistent optical sensing performance. This may include the use of components with different average lifetimes being positioned on different printed circuit boards, the use of integrated photodiode modules for sensing applications, and/or temperature sensors compressed between a heating block and one or more corresponding printed circuit boards.