Spectroscopy Module Light Passing Hole and Adhesive Dam
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional spectroscopy modules face reliability issues due to potential deviations in the relative positional relationship between the incident slit portion and the diode, leading to reduced performance.
Innovation Solution
The spectroscopy module incorporates a light passing hole in the light detecting element, optical resin adhesive for attachment, and convex portions to prevent adhesive penetration, ensuring precise alignment and reducing stress from thermal expansion differences, while a light absorbing layer minimizes stray light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the incident slit portion and the diode are attached to the supporting body using conventional methods, then the assembly process is simple, but the relative positional relationship between the incident slit portion and the diode may deviate, degrading reliability
Solution Approach 1:
The light passing hole is formed in the light detecting element before attachment to the supporting body. This preliminary formation of the hole ensures that the position is pre-determined and will not deviate during the attachment process, thereby maintaining high manufacturing precision while simplifying the overall assembly process
Solution Approach 2:
The optical resin adhesive serves as an intermediary material between the light detecting element and the supporting body. It fills the space between these components and, when cured, provides a stable bonding interface that maintains the precise relative positional relationship between the incident slit portion and the diode, thereby improving reliability without complicating assembly
2Reliability
If the light detecting element is attached directly to the supporting body, then the assembly is straightforward, but stress is generated onto the light detecting element due to thermal expansion difference, degrading reliability
Solution Approach 1:
The optical resin adhesive acts as a stress-absorbing intermediary layer between the light detecting element and the supporting body. This adhesive layer has different thermal expansion properties that can accommodate the thermal expansion difference between the two rigid components, thereby reducing stress on the light detecting element during temperature changes and improving overall reliability
Solution Approach 2:
The use of optical resin adhesive changes the mechanical and thermal parameters of the assembly interface. The adhesive provides a compliant bonding interface with different thermal expansion characteristics compared to rigid direct attachment, allowing the system to better handle thermal stress while maintaining component integrity
3Ease of manufacture
If optical resin adhesive is applied without restrictions, then the attachment process is simple, but the adhesive may penetrate into the light passing hole, causing light refraction or diffusion that degrades measurement precision
Solution Approach 1:
The light passing hole is formed in the light detecting element before the attachment process. This preliminary formation allows for precise positioning and provides a defined pathway for light that must be maintained. The hole's position and dimensions are established beforehand, ensuring that subsequent adhesive application will not compromise measurement precision
Solution Approach 2:
The convex portion is formed at a specific location on the light detecting element - between the light detecting portion and the light passing hole. This localized structural feature creates a physical barrier only where needed to prevent adhesive penetration into the light path, while leaving other areas open for proper adhesive bonding. This maintains measurement precision without overly complicating the attachment process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the spectroscopy module by maintaining precise positional relationships and reducing light refraction or diffusion, thereby improving measurement accuracy.
Implementation Method 1
it is possible to reduce a stress generated onto the light detecting element due to a thermal expansion difference between the light detecting element and the body portion
Implementation Method 2
the optical resin adhesive is dammed at the first convex portion. Therefore, the optical resin adhesive is prevented from penetrating into the light passing hole
Implementation Method 3
a light absorbing layer having a first light passing portion through which the light advancing to spectroscopic portion passes, and a second light passing portion through which the lights advancing to the light detecting portion of the light detecting element pass, is preferably formed on the predetermined plane. Because stray light is prevented from being generated and stray light is absorbed by the light absorbing layer
Implementation Method 4
a spectroscopic portion that disperses a light made incident into the body portion from a side of a predetermined plane of the body portion
Data Source
AI summary
In a spectroscopy module 1, a light passing hole 50 through which a light L1 advancing to a spectroscopic portion 4 passes is formed in a light detecting element 5. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is bonded to a front plane 2a of a substrate 2 with an optical resin adhesive 63. Thus, it is possible to reduce a stress generated onto the light detecting element 5 due to a thermal expansion difference between the light detecting element 5 and the substrate 2. Additionally, on the light detecting element 5, a first convex portion 101 is formed so as to be located at least between the light detecting portion 5a and the light passing hole 50 when viewed from a direction substantially perpendicular to the front plane 2a. Thus, when the light detecting element 5 is attached to the substrate 2 via the optical resin adhesive 63, the optical resin adhesive 63 is dammed at the first convex portion 101. Thus, the optical resin adhesive 63 is prevented from penetrating into the light passing hole 50.