Spherical Antenna Layout With Uniform Traces for AiP Packaging
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Solution Overview
Problem
Existing antenna-in-package (AiP) designs face challenges with unequal driver-to-antenna distances and require complex beam forming techniques due to two-dimensional structures, leading to increased costs and complexity, while three-dimensional structures are costly to implement.
Innovation Solution
The use of spherical antenna arrangements with three-dimensional plated antenna structures, where antennas are arranged in a circular pattern around the die with uniform trace lengths, allowing for easier electromagnetic radiation propagation and reducing the need for extensive beam forming techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If two-dimensional patch antenna arrays are used, then the antenna structure is simple to manufacture, but the package and die form factors increase and unequal driver-to-antenna distances occur
Solution Approach 1:
The patent transitions from two-dimensional planar patch antennas to three-dimensional spherical antenna structures. This dimensional change allows the antennas to be positioned in a spherical arrangement around the die, enabling equal-distance positioning from the driver while maintaining compact form factors. The 3D structure achieves better spatial utilization compared to 2D planar arrays.
2Ease of manufacture
If two-dimensional patch antenna arrays are used, then the manufacturing process is simple, but beam forming techniques are required to improve communication
Solution Approach 1:
By moving to 3D spherical antenna structures, the patent achieves inherent omnidirectional radiation patterns that eliminate the need for complex beam forming techniques. The spherical geometry naturally provides uniform radiation in all directions, simplifying the overall system complexity while maintaining manufacturing simplicity.
3Adaptability or versatility
If AiP is split into several sub modules placed in various X, Y, and Z directions, then radiation direction is optimized, but cost and complexity increase due to complex interconnect architecture
Solution Approach 1:
The patent merges multiple antenna elements into a unified spherical antenna structure that radiates omnidirectionally. This consolidation eliminates the need for complex interconnect architectures required by distributed sub-modules, while still achieving optimal radiation characteristics through the spherical geometry and uniform trace length design.
4Adaptability or versatility
If three-dimensional structures are used for antennas, then radiation direction is optimized, but manufacturing costs significantly increase due to special three-dimensional surface processes
Solution Approach 1:
The spherical antenna structures are formed using self-aligned plating processes where the antenna traces automatically conform to the spherical substrate surface during manufacturing. This self-service approach eliminates the need for complex post-fabrication 3D surface processing, achieving optimized radiation patterns through standard semiconductor manufacturing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient electromagnetic radiation propagation in the X-Y plane, minimizes signal propagation and reception issues, and reduces costs by simplifying the interconnect architecture, while maintaining effective communication with external devices.
Implementation Method 1
three-dimensional shapes require special three-dimensional surface processes, which lead to significantly higher costs
Data Source
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Figure 3A~3B
Figure 4A~4B
AI summary
Embodiments disclosed herein include a communication module. In an embodiment, the communication module comprises a package substrate, and a die on the package substrate. In an embodiment, a plurality of antennas are around the die. In an embodiment, the plurality of antennas are coupled to the die by a plurality of traces, and heights of each of the plurality of antennas is greater than a thickness of the traces.