Spherical Antenna Layout With 3D Plated Structures for Uniform Traces
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Solution Overview
Problem
Existing antenna-in-package (AiP) designs face challenges with unequal driver-to-antenna distances and require complex beam forming techniques due to two-dimensional configurations, leading to increased costs and complexity, while three-dimensional structures are costly to implement.
Innovation Solution
The use of spherical antenna arrangements with three-dimensional plated antenna structures, where antennas are uniformly spaced around a die to facilitate easier electromagnetic radiation propagation and minimize cross-talk, reducing the need for extensive beam forming techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If two-dimensional antenna arrays are used on the package substrate, then the antenna structure is simple to manufacture, but the distance from the output driver to the antenna area is unequal and beam forming techniques are required
Solution Approach 1:
The patent transitions from two-dimensional planar antenna arrays to three-dimensional spherical antenna structures. The spherical antennas are positioned at different X, Y, and Z coordinates, creating a volumetric arrangement that enables uniform distance from the output driver to all antenna elements, eliminating the need for complex beam forming techniques while maintaining manufacturing feasibility through standard PCB drilling and plating processes.
2Reliability
If three-dimensional antenna structures are used, then uniform distance to output driver and improved radiation direction are achieved, but manufacturing cost increases significantly
Solution Approach 1:
The spherical antenna structure is segmented into multiple discrete antenna elements positioned at specific coordinates on the package substrate. Each antenna element is independently manufactured using standard PCB techniques (drilling, plating, routing), allowing the complex three-dimensional structure to be built from simpler components. This segmentation enables uniform driver-to-antenna distances and improved radiation characteristics without requiring expensive monolithic three-dimensional manufacturing processes.
3Productivity
If spherical antenna arrangements with three-dimensional plated structures are used, then electromagnetic radiation propagation is improved and cross-talk is minimized, but manufacturing process complexity increases
Solution Approach 1:
The patent implements three-dimensional plated antenna structures that extend in the Z-direction from the package substrate surface. These vertically plated antennas create spherical radiation patterns and improve electromagnetic radiation propagation in multiple directions. The Z-dimensional plating is achieved through standard electroplating processes applied to vertically drilled holes, adding dimensional complexity without requiring new manufacturing technologies.
Solution Approach 2:
The spherical antenna structures are positioned at specific locations and orientations to optimize radiation patterns for different communication directions. Each antenna element has locally optimized properties (position, orientation, plating thickness) to minimize cross-talk with adjacent elements and maximize radiation efficiency in desired directions, while the overall structure remains manufacturable with existing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient electromagnetic radiation propagation in a plane parallel to the X-Y plane, reduces complexity and cost by ensuring uniform trace lengths, and minimizes cross-talk between antennas, thereby enhancing communication efficiency.
Implementation Method 1
three-dimensional plated antenna structures, where antennas are uniformly spaced around a die to facilitate easier electromagnetic radiation propagation
Implementation Method 2
a first plated structure that is coupled to a die through a first trace and that emits electromagnetic radiation in a first direction and a second plated structure that is coupled to the die through a second trace and that emits electromagnetic radiation in a second direction
Data Source
AI summary
Embodiments disclosed herein include a communication module. In an embodiment, the communication module comprises a package substrate, and a die on the package substrate. In an embodiment, a plurality of antennas are around the die. In an embodiment, the plurality of antennas are coupled to the die by a plurality of traces, and heights of each of the plurality of antennas is greater than a thickness of the traces.