Spherical Buffer Module for PCB Impact and Solder Crack Protection
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Solution Overview
Problem
Electronic devices suffer damage and solder cracks when subjected to impact forces, leading to poor contact or dislodgment of electronic elements due to bending or deformation of the circuit board.
Innovation Solution
A buffer module comprising a base with a groove and a movably disposed spherical body, coupled with an elastic element, absorbs external forces to reduce damage by providing a buffer stroke and guiding the spherical body's movement to return to its initial position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the electronic device is subjected to impact force, then the external force is applied to the device, but the circuit board bends or deforms causing solder cracks
Solution Approach 1:
The buffer module is pre-installed between the circuit board and casing to provide cushioning before impact occurs. The elastic element is pre-positioned to compress and absorb impact forces, protecting the circuit board and solder joints from damage during drop or impact events.
Solution Approach 2:
The buffer module acts as an intermediary component between the circuit board and casing. It absorbs and dissipates impact forces through the elastic element and spherical body mechanism, preventing direct transmission of shock to the circuit board and solder joints.
2Stability of the object's composition
If the circuit board is rigidly fixed, then structural stability is improved, but impact forces cause bending and deformation
Solution Approach 1:
The buffer module introduces dynamic elements (movable spherical body, compressible elastic element) between the circuit board and casing. This allows the structure to adapt dynamically to impact forces through compression and movement, rather than rigidly resisting all forces, thereby protecting the circuit board from bending and deformation.
3Object-affected harmful factors
If the buffer module includes a movably disposed spherical body, then buffer stroke and impact absorption are improved, but device complexity increases
Solution Approach 1:
The buffer module uses a spherical body as the core movable element. The spherical shape naturally provides multi-directional movement capability and smooth rolling motion, enabling effective impact absorption from various directions while maintaining a relatively simple geometric form that is easy to manufacture and integrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer module effectively absorbs external forces, reducing damage to the electronic device and preventing electronic elements from dislodging, even when impacted from various directions, by utilizing the spherical body's mobility and elastic element's deformation.
Implementation Method 1
the elastic element may absorb an external force and reduce the damage caused to the electronic device by the external force
Implementation Method 2
The spherical body of the buffer element is movably disposed relative to the base to provide a buffer stroke
Data Source
AI summary
A buffer module including a base, a buffer element and an elastic element is provided. The base has a groove. The buffer element includes a spherical body movably disposed in the groove. The elastic element is disposed between a bottom surface of the groove and the spherical body.