Spherical Conductor Carrier Structure for Sub-100 μm Precision
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Solution Overview
Problem
Existing methods for producing carrier structures for electrical components, such as 3D printing and additive manufacturing, face challenges with high shrinkage and limited miniaturization capabilities, making it difficult to create structures with dimensions below 100 μm efficiently and cost-effectively.
Innovation Solution
A carrier structure comprising spherical conductor and insulating bodies with diameters between 1 μm and 50 μm, made from metals like copper, nickel, and insulating materials, which are arranged in a dense packing configuration and connected using solder or thermoplastic means, allowing for precise control of thermal and electrical properties and enabling small structure sizes and high-current applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If 3D printing and additive manufacturing methods are used to produce carrier structures, then production speed and flexibility are improved, but manufacturing precision deteriorates due to high shrinkage and inability to achieve dimensions below 100 μm
Solution Approach 1:
The patent divides the conductor structure into discrete spherical conductor bodies (11) that are individually positioned and connected. This segmentation allows each sphere to be precisely placed and connected without the cumulative shrinkage errors inherent in continuous 3D printing, enabling accurate sub-100 μm dimensions while maintaining rapid production through parallel processing of multiple spheres.
2Manufacturing precision
If conventional manufacturing methods are used to miniaturize structures, then dimensional precision is improved, but production cost and complexity increase
Solution Approach 1:
The patent replaces complex mechanical miniaturization processes with a simplified system of spherical bodies connected by solder bridges. The spherical geometry provides inherent mechanical stability and ease of connection, eliminating the need for complex alignment and bonding mechanisms required by conventional miniaturization methods, thus reducing production complexity while achieving sub-100 μm dimensions.
3Reliability
If conductor structure density is increased to improve electrical properties, then electrical conductivity is improved, but thermal management becomes more difficult due to heat accumulation
Solution Approach 1:
The patent applies local quality by creating non-uniform spacing between spherical conductor bodies in different regions of the carrier structure. Areas requiring high electrical conductivity have denser sphere packing, while areas requiring thermal dissipation have sparser packing with larger inter-sphere gaps. This allows simultaneous optimization of electrical and thermal properties in different locations of the same structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables rapid, low-cost production of carrier structures with improved thermal and electrical properties, allowing for small structure sizes and high-current applications, while minimizing voids and enhancing mechanical stability.
Implementation Method 1
The spherical elements are connected to one another, in particular by melting the connecting means
Implementation Method 2
The connecting means comprises, in particular, a metal, e.g. one of the following metals: tin, indium, silver, gold, copper. The first connecting means is preferably a solder
Data Source
AI summary
In an embodiment a carrier structure includes at least one conductor structure configured for electrically contacting electrical components, wherein the conductor structure includes a plurality of conductor bodies, wherein at least some of the conductor bodies are in direct contact with electrically conductive first connectors, and wherein the conductor structure includes the conductor bodies and the first connectors.