Spherical Connector for Uniform Semiconductor Test Contact Force

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Solution Overview

Problem

Conventional contact apparatuses for semiconductor devices fail to apply a uniform force simultaneously to all external terminals and socket pins, leading to sequential connection, excessive force on some terminals, deformation, and reduced yield due to angled force application.

Innovation Solution

Incorporating a spherical connector between the pusher and pusher block in the contact apparatus, allowing for point contact and even force distribution, which enables simultaneous connection of all external terminals and socket pins, preventing deformation and ensuring a stable contact force.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If a greater force is applied between the semiconductor package and the test equipment to secure the contact force, then the contact force is improved, but the solder balls are deformed resulting in reduced yield and poor appearance

Engineering Contradiction:
Improvecontact forceVSAvoidyield
Core Design Contradiction:
ForceVSReliability

Solution Approach 1:

The connector is designed with a spherical surface that makes point contact with the pusher or pusher block. This spherical geometry ensures that the force is applied uniformly along the lengthwise direction of socket pins, preventing deformation of solder balls while maintaining adequate contact force for stable electrical connection

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

A connector is introduced as an intermediary component between the pusher and the socket pins. This connector distributes the contact force uniformly across multiple socket pins, preventing excessive force on individual solder balls while ensuring stable electrical connection during testing

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If conventional contact apparatus is used without a spherical connector, then the structure is simpler, but the force is not applied uniformly leading to sequential connection and deformation

Engineering Contradiction:
ImprovestructureVSAvoiduniform force application
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The spherical surface of the connector automatically ensures uniform force distribution through its geometry. When the spherical connector makes point contact with the pusher and contacts multiple socket pins, the spherical shape naturally distributes the force uniformly along the lengthwise direction of each socket pin, eliminating sequential connection and deformation issues

Inventive Principle:
Principle #14Spheroidality (Curvature)

Data Source

PatentUS8981804B2Contact apparatus and semiconductor test equipment using the same
Publication Date: 2015.03.17 SAMSUNG ELECTRONICS CO LTD
  • US8981804B2 patent drawing
  • US8981804B2 patent drawing
  • US8981804B2 patent drawing

AI summary

A contact apparatus includes a pusher having first and second surfaces, the first surface being connected to a pressure unit, stoppers protruding from edges of the second surface of the pusher away from the pressure unit, a pusher block having first and second surfaces facing each other, the first surface facing the pusher, and the second surface being connected to a semiconductor device, coupling members connecting the pusher to the pusher block, and a connector disposed between the pusher and the pusher block, at least part of a surface of the connector being circular, and the circular surface making a point contact with the pusher or the pusher block.