Spherical Cooling Plate Deformation and Thermal Resistance
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Solution Overview
Problem
Thin bottom plates in cooling components used for electronic devices are prone to deformation, leading to increased thermal resistance and reduced cooling efficiency due to separation from the electronic components, especially when trying to maintain low thermal resistance.
Innovation Solution
A spherical-shaped bottom plate with thermal bonding material is used to ensure tight contact with the electronic component, utilizing screws to press the bottom plate against the component, thereby maintaining efficient heat transfer while preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the bottom plate is made thin to reduce heat resistance, then heat transfer efficiency is improved, but the bottom plate strength decreases causing deformation
Solution Approach 1:
The bottom plate is formed with a spherical shape having a specific radius of curvature. This curvature allows the bottom plate to conform to the electronic component's surface while maintaining structural strength, preventing deformation even when the plate is made thin for better heat transfer
2Stability of the object's composition
If the tightening force of screws is increased to prevent bottom plate deformation, then structural stability is improved, but thermal resistance increases due to separation from electronic component
Solution Approach 1:
The spherical shape of the bottom plate enables it to maintain stable contact with the electronic component's center region without requiring excessive tightening force. The curvature naturally conforms to the component surface, preventing separation while avoiding the thermal resistance increase that would result from over-tightening
3Temperature
If the bottom plate is made thin to reduce heat resistance, then cooling efficiency is improved, but contact uniformity deteriorates causing air gaps
Solution Approach 1:
The spherical bottom plate with specific radius of curvature maintains uniform contact across the electronic component's surface. This curvature ensures consistent contact pressure distribution, eliminating air gaps while keeping the plate thin for optimal heat transfer and cooling efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The spherical design ensures even contact with the electronic component, reducing thermal resistance and maintaining cooling efficiency by preventing air gaps and ensuring effective heat transfer.
Implementation Method 1
providing a thermal bonding material between the bottom plate and the electronic component
Implementation Method 2
the coolant takes away the heat of the electronic component
Data Source
AI summary
A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.