Spherical Core Joining Members for Multilayer Ceramic Capacitor Noise Reduction
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Solution Overview
Problem
Multilayer ceramic capacitors experience deformation-induced 'squeal' noise when surface-mounted on substrates due to electric field-induced strain, and existing solutions face challenges in accurately positioning small capacitors and ensuring strong bonding between conductive lands on capacitors and substrates.
Innovation Solution
A chip electronic component design featuring a multilayer body with spherical cores in the joining members, allowing for horizontal and offset mounting on substrates, which reduces 'squeal' noise and enhances mounting stability by distributing vibration energy effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a spherically-shaped electrically conductive structure is formed to offset the capacitor from the substrate, then squeal noise is suppressed, but accurate positioning becomes difficult for small capacitors
Solution Approach 1:
The conductive structure is divided into multiple spherical cores (typically 3-9 spheres) arranged in a specific pattern rather than a single large structure. This segmentation enables more precise positioning and alignment during mounting while still providing sufficient height to offset the capacitor from the substrate and reduce squeal noise.
Solution Approach 2:
The conductive structure extends in the height direction (Z-axis) with multiple spherical cores arranged at different heights or positions, creating a three-dimensional configuration. This dimensional approach allows the structure to provide both the necessary height for noise suppression and precise positional control for small capacitors.
2Ease of manufacture
If a single electrically conductive structure is used to join conductive lands on the capacitor and substrate, then mounting is simplified, but bonding strength becomes weak
Solution Approach 1:
The conductive structure consists of multiple spherical cores that are electrically connected, creating multiple bonding points between the capacitor and substrate. This segmented structure distributes the mechanical and electrical connection across multiple points, significantly enhancing bonding strength while maintaining ease of mounting through the spherical geometry that facilitates soldering.
Solution Approach 2:
The conductive structure combines multiple spherical cores made of conductive material (such as solder or conductive paste) that are fused together during the mounting process. This composite structure provides both mechanical strength through multiple bonding points and electrical conductivity, resolving the contradiction between mounting simplicity and bonding strength.
3Object-affected harmful factors
If the capacitor is offset in height from the substrate, then squeal noise is reduced, but mounting stability deteriorates
Solution Approach 1:
The offset structure is segmented into multiple spherical cores distributed across the capacitor's conductive lands, providing multiple support points that enhance mounting stability. The segmentation allows the structure to maintain the necessary height offset for noise reduction while distributing mechanical support across multiple contact points with the substrate.
Solution Approach 2:
The spherical cores are strategically positioned at specific locations (corners or edges) of the capacitor where they provide both the height offset needed for squeal reduction and localized support points that enhance overall mounting stability. The local quality of the conductive structure varies by position, with spheres placed to optimize both noise reduction and stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of spherical cores in joining members effectively reduces 'squeal' noise and improves mounting stability by supporting the electronic component and distributing vibration energy, achieving sound pressure levels of 55 dB or less in experimental measurements.
Implementation Method 1
each of the first joining member and the second joining member includes a plurality of spherical cores... the plurality of spherical cores supports the electronic component main body... distributing vibration energy effectively
Implementation Method 2
A dielectric contributing to formation of the capacitance resulting from the internal electrodes facing each other as described above causes electric field-induced strain in accordance with the applied voltage
Data Source
AI summary
A multilayer ceramic capacitor includes a multilayer body having a rectangular parallelepiped shape. A first external electrode is disposed on at least a first end surface and a first main surface of the multilayer body. A second external electrode is disposed on at least a second end surface and a first main surface of the multilayer body. A first joining member is electrically connected to the first external electrode. A second joining member is electrically connected to the second external electrode. Each of the first joining member and the second joining member includes a plurality of spherical cores.