Spherical Extension Electrode Micro-LED Alignment
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Solution Overview
Problem
The manufacturing process of micro-LED displays faces challenges in alignment and packaging due to the need for precise arrangement of LEDs on electronic substrates, which affects the reliability and efficiency of the display.
Innovation Solution
A light-emitting device with a spherical extension electrode is used, where the electrode is electrically connected to a semiconductor epitaxial structure, and a manufacturing method involves a porous plate with openings to facilitate smooth contact between the spherical extension electrodes and pads on the substrate, allowing for efficient packaging of micro-LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LEDs are precisely arranged on predetermined positions of contacts on the substrate, then alignment precision is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent introduces a spherical extension electrode as an intermediary element between the LED chip and the substrate contact. This spherical structure facilitates easier alignment and bonding by providing a larger contact area and more tolerant positioning, thereby reducing manufacturing complexity while maintaining alignment precision
Solution Approach 2:
The spherical extension electrode is pre-formed on the LED chip before mounting. This preliminary action allows the alignment and positioning to be performed on the more tolerant spherical structure, which can then be precisely bonded to the substrate contact, simplifying the overall manufacturing process
2Ease of manufacture
If spherical extension electrodes are used to facilitate smooth contact with pads, then ease of manufacture is improved, but device volume increases
Solution Approach 1:
The patent employs a spherical extension electrode instead of a flat electrode. The spherical shape provides superior contact properties with the pad, facilitating easier alignment and bonding during manufacturing. The curved surface allows for more tolerant positioning while ensuring reliable electrical contact
Data Source
AI summary
In an embodiment, a light emitting device comprises a light emitting diode chip and a spherical extending electrode. The light emitting diode chip includes a semiconductor epitaxial structure, a first electrode and a second electrode. The first electrode and the second electrode are disposed on two opposite sides of the semiconductor epitaxial structure, respectively. The first electrode is disposed between the semiconductor epitaxial structure and the spherical extending electrode, and the spherical extending electrode is electrically connected to the semiconductor epitaxial structure electrically through the first electrode. The volume of the spherical extending electrode is greater than that of the light emitting diode chip.