Spherical Filler Heat Dissipation Material for Low Dielectric Noise
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Solution Overview
Problem
Current heat dissipation materials for electronic components do not adequately address the need for low dielectric properties in addition to high thermal conductivity, which is essential for reducing noise in electronic devices as their functionality increases.
Innovation Solution
A heat dissipation material with a specific ratio of spherical fillers, including large-diameter and small-diameter fillers, dispersed in a resin, optimizing the particle size distribution to achieve high thermal conductivity while minimizing the dielectric constant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high thermal conductivity is achieved by using spherical AlN sintered powder with low porosity, then heat dissipation properties are improved, but dielectric constant reduction is not addressed
Solution Approach 1:
The invention changes the particle size distribution parameter of the filler, specifically incorporating a bimodal distribution with 20-80 mass% of particles in 10-500 μm range and 20-80 mass% of particles in 1-10 μm range. This parameter change enables simultaneous achievement of high thermal conductivity (through larger particles) and low dielectric constant (through optimized particle packing with smaller particles), resolving the technical contradiction between heat dissipation and dielectric properties
Solution Approach 2:
The invention uses a composite filler system combining spherical AlN sintered powder with specific particle size distribution in a resin matrix. The composite structure with bimodal particle size distribution allows the material to exhibit both high thermal conductivity and low dielectric constant properties, addressing the contradiction by creating a multi-functional composite material
2Temperature
If filler particle size is increased to improve thermal conductivity, then heat dissipation is enhanced, but dielectric constant reduction is compromised
Solution Approach 1:
The invention segments the filler particle size into two distinct size ranges: 10-500 μm for thermal conductivity and 1-10 μm for dielectric constant control. This segmentation allows each particle size range to perform its specific function optimally, with larger particles providing thermal pathways and smaller particles filling voids to reduce dielectric constant, thereby resolving the contradiction between thermal conductivity and dielectric properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material effectively dissipates heat and reduces noise in electronic components, enabling high functionality in devices by balancing thermal conductivity and dielectric properties.
Implementation Method 1
a spherical AlN sintered powder having a spherical form, an average particle size of 10 to 500 μm, and a porosity of 0.3% or less
Data Source
AI summary
A heat dissipation material that has insulating properties and uses spherical fillers includes at least one of a filler having a particle size of 200 μm or more and 1000 μm or less and having a ratio of 20% or more and a filler having a particle size of 1 nm or more and 10 μm or less and having a ratio of 20% or more, with respect to the total amount of the fillers.