Spherical LED Substrate for Heat Dissipation
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Solution Overview
Problem
LED lighting apparatuses face challenges in heat dissipation, which affects their efficiency and longevity, as traditional designs do not adequately manage thermal issues.
Innovation Solution
The bulb apparatus incorporates a substrate with multiple LED chips arranged on an aluminum substrate, which is bent to direct light at various angles and features a three-dimensional structure with gaps for airflow, combined with a plastic layer for enhanced heat dissipation, and a driving component for efficient power conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional LED lighting apparatus designs are used, then manufacturing simplicity is maintained, but heat dissipation performance deteriorates
Solution Approach 1:
The patent transitions from traditional planar LED mounting to a three-dimensional spherical substrate structure. Multiple LED chips are arranged on the spherical surface, allowing light to emit in multiple directions (upward, downward, sideways) simultaneously. This dimensional change increases the surface area for heat dissipation and improves light distribution while maintaining compact form factor.
Solution Approach 2:
The spherical substrate is divided into multiple segments or zones, each carrying LED chips oriented in different directions. The bulb is also segmented into distinct functional regions: the spherical light source assembly, the separate bulbous body for heat dissipation, and the base section. This segmentation allows independent optimization of light emission patterns and thermal management.
2Illumination intensity
If multiple LED chips are arranged on a substrate, then light distribution is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent separates the light-generating function from the heat-dissipating function. The spherical substrate with LED chips is extracted as a distinct light source assembly, while the bulbous body serves as a dedicated heat dissipation structure. This separation allows the LED array to focus on light emission while the larger bulb surface area handles thermal management independently.
Solution Approach 2:
Different regions of the device are assigned different functional qualities: the spherical substrate region is optimized for light emission with densely packed LED chips, while the bulbous body region is optimized for heat dissipation with larger surface area and potentially different material properties. Each local region performs its specialized function effectively.
3Adaptability or versatility
If a three-dimensional substrate structure is used, then light emission in multiple directions is achieved, but manufacturing complexity increases
Solution Approach 1:
The spherical substrate serves multiple functions simultaneously: it acts as the mounting platform for LED chips, provides structural support, enables multi-directional light emission, and contributes to the overall aesthetic design. The bulbous body also serves dual purposes as both a heat dissipation structure and a protective enclosure. This multi-functionality reduces the need for additional separate components.
Solution Approach 2:
The patent merges several functions into integrated components: the substrate both holds LED chips and directs light; the bulbous body both dissipates heat and protects internal components; the base both provides electrical connection and structural support. This merging simplifies assembly by reducing the number of separate parts that need to be manufactured and assembled.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation and light distribution while reducing manufacturing costs and maintaining high efficiency, ensuring effective cooling and environmental sustainability.
Implementation Method 1
The multiple light source components and the base may share the same substrate... The material of the same substrate may include aluminum... The substrate is connected to the light source components, so the whole also be regarded as a radiator.
Implementation Method 2
the substrate may be folded to form a three-dimensional hollow light source assembly... The intermediate portion of the base may have at least one hole to enhance heat dissipation.
Implementation Method 3
The driving component... converts the external power source into a current suitable for driving multiple light source components for driving the multiple light source components to emit light.
Implementation Method 4
a heat dissipation material may be coated between the LED chips and the substrate, for example, the heat dissipation material keeping in a gel state, and the heat dissipation material increases the heat transfer effect between the LED chips and the substrate.
Data Source
AI summary
A bulb apparatus including a bulb, a light cap, a light source assembly and a driving component. The light cap has an inner wall and an outer wall. The outer wall is used for accessing to an external power source. The light source assembly includes a base and the multiple light source components. The base carrying the multiple light source components which form an angle with respect to a predetermined position with respect to the bulb. The bottom outer shape of the base is connected with the inner wall of the light cap. The driving component is disposed in a hole surrounded by the base. The driving component is connected to external power source through a terminal.