Spherical Silica Particles With Fine Voids for Plating Reliability

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Solution Overview

Problem

Existing methods for producing hollow silica particles face challenges in achieving high hollowness without compromising particle strength, and struggle to produce particles with diameters smaller than 5 μm, leading to issues in plating reliability and filler performance.

Innovation Solution

Spherical silica particles are produced using an alkaline aqueous solution of silicic acid as a raw material, involving a hydrothermal treatment and heating process to create fine voids, with specific conditions to control void size and distribution, resulting in particles with a true specific gravity retention rate of 80% or higher and a pore volume of 0.1 mL/g or lower.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If wet template methods are used to produce hollow silica particles with large voids, then the degree of hollowness is increased, but the particle strength decreases and plating reliability is compromised

Engineering Contradiction:
Improvedegree of hollownessVSAvoidparticle strength
Core Design Contradiction:
Quantity of substanceVSStrength

Solution Approach 1:

The patent divides the single large void into multiple fine voids distributed throughout the particle interior. This segmentation approach maintains the overall hollowness (degree of hollowness) while preventing the formation of large continuous void spaces that would compromise structural integrity. The fine voids are dispersed throughout the particle, creating a more uniform stress distribution and preventing weak points that would lead to particle fracture during via processing and plating operations.

Inventive Principle:
Principle #1Segmentation

2Length of stationary object

If conventional methods are used to produce hollow silica particles, then particles with diameters of 5 μm or smaller are difficult to obtain, but smaller particle sizes are needed for certain applications

Engineering Contradiction:
Improveparticle diameterVSAvoidmanufacturability
Core Design Contradiction:
Length of stationary objectVSEase of manufacture

Solution Approach 1:

The patent employs parameter changes in the sol-gel process, specifically controlling the water-to-silica molar ratio, pH conditions, and aging time to enable the formation of hollow spherical silica particles with diameters of 5 μm or smaller. By adjusting these chemical parameters during synthesis, the method achieves precise control over particle size while maintaining the hollow structure, making small particles manufacturable for the first time using this approach.

Inventive Principle:
Principle #35Parameter changes

3Quantity of substance

If particles with large internal voids are used as fillers, then the degree of hollowness is high, but the voids are exposed during via processing, causing plating reliability issues

Engineering Contradiction:
Improvedegree of hollownessVSAvoidplating reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent segments the large internal voids into numerous fine voids distributed throughout the particle. This segmentation prevents the exposure of large continuous void surfaces during via processing, as the fine dispersed voids do not create the same structural weaknesses. The segmented void structure maintains high degree of hollowness while ensuring that no single void exposure would compromise plating reliability during electronic material fabrication.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resulting silica particles have finer voids, enhancing their resistance to fracture under external forces and maintaining structural integrity, suitable for use as fillers in electronic materials.

Implementation Method 1

a hydrothermal treatment step of substituting, with water, a dispersion medium which is contained in the liquid dispersion and in which the raw material silica particles are dispersed, and then performing pressurization and heating to 130° C. or higher and 250° C. or lower

Methodology Applied
Scientific EffectHydrothermal treatment:

Implementation Method 2

a heating step of heating the liquid dispersion or the raw material silica particles obtained from the liquid dispersion through solid-liquid separation so as to remove an organic substance contained in the liquid dispersion

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 3

a raw material silica particle preparation step of preparing a liquid dispersion of raw material silica particles from a raw material solution obtained by dissolving silicic acid in a mixed solvent of water and an organic solvent in the presence of a basic substance

Methodology Applied
Scientific EffectDissolution: Solvation

Data Source

PatentUS12454460B2Spherical silica particles, slurry composition, resin composition, and method for producing spherical silica particles
Publication Date: 2025.10.28 ADMATECHS CO LTD
  • US12454460B2 patent drawing
  • US12454460B2 patent drawing
  • US12454460B2 patent drawing

AI summary

An object is to provide a novel method for producing spherical silica particles having fine voids. That is, spherical silica particles according to the present disclosure contain silica as a main component, have an average particle diameter of 0.1 to 10.0 μm, a true specific gravity of 0.9 to 1.9 g/cm3, the true specific gravity being measured with nitrogen gas, a pore volume of 0.1 mL/g or lower, an Na content of 10 ppm or lower, and a true specific gravity retention rate of 80% or higher, the true specific gravity retention rate being measured with nitrogen gas and being a rate between before and after pressurization is performed at 300 MPa for 1 minute, and include, in an existence proportion of 60% or lower, particles in each of which a maximum value among major axes of internal voids is not smaller than half a major axis of the particle.