Spheroidal Speaker Housing for Acoustic Reflection Reduction

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Solution Overview

Problem

Existing speaker designs with parallel internal surfaces exacerbate sound reflections and reverberations, leading to impaired sound quality and increased complexity due to mechanical noise transfer, which requires significant software filtering.

Innovation Solution

A speaker design featuring a spheroidal speaker housing mounted to a heat sink, minimizing acoustic reflections and mechanical noise transfer while maximizing driver and radiator performance, achieved through a direct mounting arrangement that reduces parts and complexity, and enhances thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If parallel internal surfaces are used in speaker housing, then manufacturing is simplified, but acoustic reflections and reverberations are exacerbated

Engineering Contradiction:
Improvespeaker housing manufacturingVSAvoidacoustic reflections
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The speaker housing employs a spheroidal internal geometry instead of parallel surfaces. This curved surface design causes sound waves to disperse in multiple directions rather than reflecting along parallel paths, thereby eliminating standing waves and reverberations while maintaining manufacturing feasibility through molding processes.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Ease of manufacture

If traditional mounting arrangements are used, then assembly is simplified, but mechanical noise transfer to circuit boards increases

Engineering Contradiction:
Improveassembly simplicityVSAvoidmechanical noise
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The heat sink serves as an intermediary mounting structure between the speaker housing and the shell. The speaker housing is mounted to the heat sink rather than directly to the shell, creating a decoupling effect that reduces mechanical noise transfer to circuit boards while maintaining assembly simplicity through the integrated heat sink structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Object-generated harmful factors

If more software filtering is applied, then sound quality is improved, but device complexity and power consumption increase

Engineering Contradiction:
Improvesound qualityVSAvoidsoftware filtering requirements
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The invention converts the potentially harmful effect of mechanical vibrations into a beneficial mounting mechanism. By mounting the speaker housing to the heat sink, the vibrations are utilized for heat dissipation purposes while being isolated from circuit boards, thereby reducing the need for software filtering and lowering overall system complexity.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively minimizes acoustic reflections, maximizes sound quality, reduces mechanical noise, and lowers power consumption while simplifying the speaker's design and reducing software filtering requirements, resulting in a cost-effective and efficient sound production.

Implementation Method 1

heat sink

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat sink

Methodology Applied
Scientific EffectThermal convection: Convection

Implementation Method 3

soundwaves can bounce along parallel paths between the parallel internal surfaces, standing waves, internal reflections, and reverberations

Methodology Applied
Scientific EffectAcoustic reflection: Reflection

Data Source

PatentUS11405727B2Speaker
Publication Date: 2022.08.02 ARRIS ENTERPRISES LLC
  • US11405727B2 patent drawing
  • US11405727B2 patent drawing
  • US11405727B2 patent drawing

AI summary

A speaker includes a shell, a speaker housing, and a heat sink. The heat sink is fixed inside the shell. The speaker housing is mounted to the heat sink such that the speaker housing is suspended from the heat sink inside the shell. An interior of the speaker housing is spheroidal.