SPI Memory PCB Pad Layout for Reliable Multi-IC Data Writing
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Solution Overview
Problem
Existing methods for writing data into multiple SPI memory ICs in information processing apparatuses are inefficient and can reduce reliability, especially when dealing with larger memory capacities and multiple ICs, as they often require time-consuming solder removal or use clip jigs that are difficult to manage.
Innovation Solution
The solution involves a printed board with expansion pad patterns and positioning through holes that allow a writing jig to connect to SPI memory ICs, along with conductor parts connected to chip select terminals, enabling selective data writing without solder removal, using a selection switch part to choose the appropriate IC.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the method of removing soldering is used to write data into SPI memory ICs, then data writing can be performed, but it is time consuming and reduces reliability
Solution Approach 1:
The printed board is segmented to include separate functional elements: expansion pad patterns for electrical connection, positioning through holes for mechanical alignment, and conductor parts for chip select signaling. This segmentation allows the writing jig to connect without removing soldering, maintaining reliability while enabling data writing.
Solution Approach 2:
The expansion pad pattern acts as an intermediary between the SPI memory IC terminals and the writing jig. It provides a soldering-free connection path that allows the writing jig to access the IC terminals without disturbing the original soldering, thus maintaining reliability while enabling data writing.
2Ease of manufacture
If the method of using a clip jig is used to write data into SPI memory ICs, then data writing can be performed, but it is difficult to deal with multiple SPI memory ICs
Solution Approach 1:
The expansion pad pattern is designed with universal functionality to support multiple SPI memory ICs. By extending around each IC and connecting to terminals through positioning through holes, the same pad pattern structure can accommodate any SPI memory IC on the board, enabling the writing jig to handle multiple ICs uniformly.
Solution Approach 2:
The expansion pad pattern extends beyond the minimal connection points to provide additional connection paths and positioning references. This excessive extension ensures that the writing jig can reliably connect to any SPI memory IC terminal while maintaining adaptability across multiple ICs.
3Ease of manufacture
If the expansion pad pattern is arranged to extend around the IC, then the writing jig can connect to the terminal, but the space requirement increases
Solution Approach 1:
The expansion pad pattern is strategically arranged to extend only in specific directions where connection to IC terminals is required. Rather than uniformly expanding in all directions, the pad pattern extends locally toward the terminals, minimizing overall area consumption while ensuring writing jig connectability.
Data Source
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AI summary
The present invention provides an information processing apparatus which writes data into a plurality of SPI memory ICs without reducing reliability. The information processing apparatus includes a plurality of SPI memory ICs connected to a control unit by an SPI (Serial Peripheral Interface), and a printed board mounted with the SPI memory ICs. The printed board includes an expansion pad pattern which is a soldering pad pattern at a terminal of at least one of the SPI memory ICs and is arranged to extend around the IC so that a writing jig is connectable to the terminal, a through hole for positioning when connecting the writing jig to the terminal, and a conductor part connected to a chip select terminal of each of the SPI memory ICs so that one of the SPI memory ICs is selectable from the writing jig.