Spin Chuck Anti-Slip Structure for Crack-Free Substrate Fixing
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Solution Overview
Problem
Existing spin chucks in semiconductor manufacturing processes face issues with slip between rotating components and potential cracking due to movement of chucking pins, which can lead to substrate damage and processing inefficiencies.
Innovation Solution
A spin chuck design that incorporates an anti-slip plate with a higher friction coefficient, coupled with a chucking pin mechanism that reduces impact through a ring wing structure, to prevent slip and cracking during high-speed and low-speed rotations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional spin chuck structure is used, then the device is simple, but slip occurs between the upper plate and lower plate during rotation
Solution Approach 1:
An anti-slip plate is introduced as an intermediary component between the upper plate and lower plate. This anti-slip plate includes protrusions that engage with grooves on the upper plate, creating a mechanical connection that prevents relative slipping between the rotating upper plate and stationary lower plate during high-speed and low-speed rotation phases.
Solution Approach 2:
The connection between upper and lower plates is segmented into discrete engagement points through multiple protrusions and grooves. This segmentation allows the anti-slip plate to prevent slipping at multiple locations simultaneously, distributing the mechanical stress and improving overall reliability without requiring a completely different structural approach.
2Reliability
If a chucking pin mechanism is used to fix the substrate, then the substrate can be securely held, but cracks may occur due to movement of the chucking pin
Solution Approach 1:
A ring wing structure is positioned beforehand to cushion and absorb the impact generated by chucking pin movement. The ring wing acts as a protective element that reduces the transmission of impact forces to the substrate, preventing cracks while maintaining secure fixation during both high-speed and low-speed rotation phases.
3Productivity
If high-speed rotation is performed for cleaning, then cleaning efficiency is improved, but slip between plates and cracking risks increase
Solution Approach 1:
The anti-slip plate serves as a stable intermediary that remains stationary during high-speed rotation of the upper plate, preventing slip between rotating and stationary components. This stable connection maintains reliability and prevents cracking even during high-speed cleaning operations.
Solution Approach 2:
The ring wing structure is positioned in advance to cushion impact forces that occur during high-speed rotation transitions. This beforehand cushioning protects the substrate and chucking pin mechanism from damage while allowing efficient high-speed cleaning to proceed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed spin chuck effectively prevents slip between rotating components and reduces the risk of cracking, ensuring reliable substrate handling and processing in semiconductor manufacturing.
Implementation Method 1
an anti-slip plate with a higher friction coefficient
Implementation Method 2
Chemical liquid or deionized water is supplied to the substrate through a spray nozzle while rotating the substrate. The chemical liquid or deionized water is spread over the entire surface of the substrate by centrifugal force
Data Source
AI summary
A spin chuck includes an upper plate having an upper surface and a lower surface, the upper plate including a groove and a support pin on the upper surface of the upper plate, wherein the support pin is configured to support a substrate; an anti-slip plate below the upper plate, the anti-slip plate having an upper surface and a lower surface, wherein the anti-slip plate includes a first protrusion protruding in a vertical direction from the upper surface of the anti-slip plate toward the upper plate; and a lower plate below the anti-slip plate, the lower plate including a chucking pin configured to fix the substrate, wherein the lower plate has an upper surface and a lower surface, wherein the first protrusion of the anti-slip plate is coupled to the groove of the upper plate.