Spin Chuck Center Heating for Pattern Collapse Prevention
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Solution Overview
Problem
In substrate processing, the high aspect ratio features on substrates lead to pattern collapse during drying due to surface tension of rinse liquids, which existing methods have not adequately addressed, resulting in defects like leaning of fins.
Innovation Solution
A substrate processing system with a spin chuck and a radiant heating assembly using LEDs or a laser end connector to provide rapid localized heating, creating a moving heat front that evaporates rinse liquids quickly, preventing meniscus formation and pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heating methods are used to evaporate rinse liquid, then the drying process takes time, but pattern collapse occurs due to surface tension and slow evaporation
Solution Approach 1:
The patent applies different heating intensities to different regions of the substrate. A radiant heat source (laser or LED) provides concentrated heating at the center where the meniscus forms, while the main heater assembly provides uniform heating across the rest of the substrate. This localized intense heating rapidly evaporates the rinse liquid at the critical center region, preventing meniscus formation and pattern collapse, while maintaining overall drying efficiency.
Solution Approach 2:
The system performs preliminary heating of the substrate before and during liquid dispensing. The main heater assembly pre-heats the substrate to a controlled temperature, and the radiant heat source is activated in advance to create a moving heat front that precedes the liquid evaporation zone. This preliminary thermal preparation ensures rapid evaporation when the liquid reaches the heated zones, preventing pattern collapse.
2Manufacturing precision
If a radiant heat source is added to provide concentrated center heating, then pattern collapse is prevented, but device complexity increases
Solution Approach 1:
The patent replaces conventional mechanical contact heating methods with a radiant heating system using light-emitting diodes (LEDs) or laser sources. This radiant heating system transfers thermal energy directly through radiation without mechanical contact, enabling precise spatial and temporal control of heat delivery. The LED array or laser can be rapidly activated and deactivated, and the heat can be precisely targeted to specific regions, simplifying the control system while achieving superior heating performance.
Solution Approach 2:
The system dynamically changes heating parameters including temperature, heating duration, and spatial distribution. The controller adjusts the intensity and timing of the main heater assembly and radiant heat source based on process requirements. This parameter control allows the system to optimize between drying speed and pattern collapse prevention, achieving high manufacturing precision without requiring overly complex hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces or eliminates pattern collapse by ensuring rapid evaporation of rinse liquids, maintaining feature integrity during the drying process.
Implementation Method 1
A radiant heating assembly is provided including a main heater assembly and a nozzle stack cap assembly with a radiant heat source such as a laser end connector or light emitting diodes (LEDs)
Implementation Method 2
The radiant heat source is arranged closer to the substrate than the first plane and is configured to heat the center of the first surface of the substrate... creating a moving heat front that evaporates rinse liquids quickly
Implementation Method 3
A radiant heating assembly is provided including a main heater assembly and a nozzle stack cap assembly with a radiant heat source such as a laser end connector or light emitting diodes (LEDs)
Implementation Method 4
a spin chuck configured to hold and rotate a substrate... as the substrate is rotated
Implementation Method 5
surface tension and the high aspect ratio of the features 1 causes the IPA 3 to be removed more slowly from spaces between the features 1
Data Source
AI summary
A substrate processing system to treat a substrate includes a spin chuck configured to hold and rotate a substrate. A heating assembly is configured to heat an opposite surface of the substrate and includes a main heater assembly and a nozzle stack cap. The main heater assembly includes a first plurality of light emitting diodes (LEDs) arranged on a first printed circuit board (PCB) in a first plane that is spaced from and parallel to a second plane including the substrate. The nozzle stack cap assembly includes at least one nozzle to dispense liquid onto a center of a first surface of the substrate. A radiant heat source is arranged closer to the substrate than the first plane and is configured to heat the center of the first surface of the substrate.