Spin Chuck In Situ Cleaning Nozzle Assembly
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Solution Overview
Problem
Existing wafer processing systems face contamination issues due to polymer by-products from photoresist removal processes depositing on chamber surfaces, leading to unacceptable particulate impurities on wafer surfaces if not properly cleaned.
Innovation Solution
A spin chuck apparatus with an in situ cleaning capability, featuring a stationary nozzle assembly that directs rinse liquid radially onto a cover's downwardly-facing surface and process liquid downwardly toward the chuck, along with a gas distribution system for simultaneous cleaning and drying, allowing for effective removal of residues without chamber disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-temperature processes are used to remove photoresist from wafers, then photoresist removal efficiency is improved, but polymer by-products deposit on chamber surfaces causing contamination
Solution Approach 1:
The patent applies preliminary action by implementing an in-situ cleaning system that prevents polymer by-product accumulation before it becomes a harmful contamination problem. The cleaning nozzle assembly is positioned to continuously or periodically rinse the spin chuck surface during or after high-temperature photoresist removal processes, thereby preventing deposit buildup that would otherwise occur from the necessary high-temperature treatment.
Solution Approach 2:
The patent converts the harmful polymer by-products into a manageable situation by using a rinsing mechanism that directs liquid flow over the spin chuck surface. The cleaning system transforms the potentially harmful deposition issue into a controlled cleaning process where rinse liquid removes by-products, and the rotating spin chuck distributes the liquid evenly to prevent re-deposition.
2Stability of the object's composition
If the process chamber is sealed to maintain process conditions, then process stability is improved, but contamination accumulates on internal surfaces
Solution Approach 1:
The patent applies multi-functionality by designing the spin chuck to serve dual purposes: it is both a wafer processing platform and a self-cleaning component. The spin chuck's rotation function is extended to also distribute cleaning liquid across its surface and the wafer surface, allowing the same component to perform both processing and cleaning functions without requiring separate cleaning mechanisms or chamber opening.
Solution Approach 2:
The patent implements self-service by enabling the spin chuck to clean itself and the wafer surface through its own rotation. The rinsing system directs liquid onto the spin chuck, and the rotation of the spin chuck automatically distributes this liquid across all surfaces that require cleaning, eliminating the need for external cleaning mechanisms or manual intervention.
3Manufacturing precision
If rinse liquid is directed onto the spin chuck surface, then cleaning effectiveness is improved, but liquid may interfere with subsequent process steps
Solution Approach 1:
The patent applies dynamics by utilizing the rotation of the spin chuck to control the behavior of rinse liquid. The rotational motion transforms the static liquid application into a dynamic process where centrifugal force and surface tension work together to distribute liquid evenly and then remove excess liquid, preventing liquid accumulation that could interfere with subsequent processing steps.
Solution Approach 2:
The patent implements periodic action through the continuous rotation of the spin chuck during the rinsing process. This periodic motion creates cycles of liquid application, distribution, and removal, ensuring that cleaning is effective while preventing liquid from remaining on surfaces where it could cause interference. The rotation can be synchronized with the processing cycle to apply liquid only when appropriate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures continuous, efficient cleaning and drying of the spin chuck and wafer surfaces, preventing contamination and maintaining surface purity during high-temperature processes, thereby reducing particulate impurities and extending the system's operational lifespan.
Implementation Method 1
These by-products are mainly polymers, which can be dissolved and rinsed away with deionized water
Implementation Method 2
a spin chuck that includes an in situ cleaning capability
Data Source
AI summary
In a method and apparatus for processing wafer-shaped articles, a spin chuck is positioned inside a process chamber. The spin chuck is configured to hold a wafer-shaped article at a predetermined process position. A cover covers the spin chuck and is affixed to or integral with the spin chuck for rotation therewith. The cover has a central opening. A stationary nozzle assembly extends into the process chamber such that a discharge end of the stationary nozzle assembly passes through the central opening of the cover. The nozzle assembly comprises a rinse nozzle configured to direct rinse liquid radially outwardly of the nozzle assembly onto a downwardly-facing surface of the cover.