Spin Chuck Pin Retraction for Uniform Substrate Liquid Films
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Solution Overview
Problem
The existing substrate treating processes face challenges in maintaining a consistent liquid film on the substrate due to the processing liquid flowing down along the chuck pins during rotation, which affects etch selectivity and uniformity, particularly in high-integration semiconductor devices.
Innovation Solution
A substrate treating apparatus and method featuring a support unit with a chuck pin that moves between contact and open positions using a cam ring and slip-ring assembly, allowing for controlled liquid film formation and maintenance during substrate rotation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chuck pin is positioned to support the substrate during rotation, then the substrate is securely held and rotated, but the processing liquid flows down along the chuck pin and the liquid film cannot be maintained
Solution Approach 1:
The chuck pin is designed to dynamically change its position between a support position (contacting the substrate) and a retracted position (spaced from the substrate). During substrate rotation, the chuck pin is retracted to prevent liquid flow-down, while during substrate loading/unloading, it extends to provide support. This dynamic positioning resolves the contradiction by making the support stability and liquid film uniformity requirements compatible through time-separated operations.
2Reliability
If the chuck pin remains in the support position during substrate rotation, then the substrate is securely supported, but processing liquid flows down along the chuck pin
Solution Approach 1:
Before the substrate rotation process begins, the chuck pin is retracted to the spaced position in advance. This preliminary action prevents the liquid flow-down problem from occurring during the subsequent rotation and processing liquid supply operations, while the substrate is securely held by other means during these operations.
3Manufacturing precision
If the chuck pin moves between contact and open positions during substrate rotation, then liquid film uniformity is maintained, but the device complexity increases
Solution Approach 1:
The chuck pin moving unit provides a mechanical mechanism that enables the chuck pin to dynamically transition between contact and open positions. This dynamic capability, while adding some device complexity, achieves the critical liquid film uniformity by preventing liquid flow-down during rotation, which is essential for high-integration semiconductor device manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient substrate treatment by preventing liquid flow-down, maintaining a predetermined liquid film, and ensuring high etch selectivity and uniformity, while enhancing durability and wear resistance through the slip-ring assembly.
Implementation Method 1
a cam ring; and a cam ring driver that rotates the cam ring, in which the other end of the rod member is in contact with the protrusion and is movable along the protrusion
Implementation Method 2
a heating unit for heating the substrate
Implementation Method 3
a slip-ring assembly for providing power to the cam ring driver; and a moving member for moving the brush member in a direction closer to the ring member or a direction away from the ring member
Data Source
AI summary
Provided is an apparatus for treating a substrate including: a processing vessel having a processing space; a support unit for supporting the substrate in the processing space and rotating the substrate; a liquid supply unit for supplying a processing liquid to the substrate; and a heating unit for heating the substrate, wherein the support unit includes: a spin chuck; a rotation driver for rotating the spin chuck; a chuck pin installed on the spin chuck to be rotated with the spin chuck; a chuck pin moving unit for moving the chuck pin between a contact position wherein the chuck pin is in contact with a side portion of the substrate and an open position at which the chuck pin is spaced apart from the side portion of the substrate, and the chuck pin moving unit moves the chuck pin while the substrate is rotated by the spin chuck.