Spin Chuck Temperature Gradient for Wafer Particle Cleaning
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Solution Overview
Problem
The down-scaling of semiconductor devices during manufacturing leads to incomplete removal of particles during wet cleaning processes, resulting in defects, reduced productivity, and increased cleaning solution usage.
Innovation Solution
A spin chuck and wafer cleaning device that form a temperature gradient on the wafer by heating the central region with a spin chuck and the outer region with temperature control liquids, causing a cleaning solution layer to flow and efficiently remove particles through thermophoresis and Marangoni convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional wet cleaning processes are used, then the cleaning process is simple, but particles cannot be completely removed due to device down-scaling
Solution Approach 1:
The patent applies parameter changes by creating a temperature gradient across the wafer surface during cleaning. The spin chuck heats the central region while lower nozzles heat the outer region, generating controlled temperature differences that drive fluid flow and enhance particle removal through thermophoresis and Marangoni convection effects
Solution Approach 2:
The patent replaces conventional mechanical cleaning mechanisms with thermal field-based cleaning. Instead of relying solely on mechanical spray and rinse actions, the system uses temperature gradients to generate thermophoretic forces and Marangoni convection currents that actively transport particles off the wafer surface
2Manufacturing precision
If rinsing processes are extended to improve particle removal, then cleaning effectiveness increases, but productivity decreases and cleaning solution usage increases
Solution Approach 1:
The patent changes the thermal parameters of the cleaning process by implementing a temperature gradient. This creates active particle transport mechanisms that achieve complete particle removal in a single, optimized cleaning cycle, eliminating the need for extended multi-step rinsing processes and thereby maintaining high productivity
Solution Approach 2:
The temperature gradient cleaning creates continuous fluid flow and convection currents throughout the cleaning solution layer on the wafer surface. This continuous active cleaning action ensures complete particle removal in one pass, eliminating the need for multiple sequential rinsing steps
3Manufacturing precision
If conventional cleaning processes are used, then cleaning solution usage is minimized, but particle removal is incomplete
Solution Approach 1:
The patent changes the thermal parameters to create a temperature gradient that enhances particle removal efficiency. This allows for complete particle removal using a single cleaning solution application, optimizing the balance between cleaning effectiveness and solution consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The temperature gradient enhances the removal of particles by promoting fluid flow and convection within the cleaning solution layer, improving cleaning efficiency, reducing defects, and optimizing cleaning solution usage.
Implementation Method 1
a temperature gradient formed by the spin chuck and the plurality of lower nozzles causes a cleaning solution layer including the cleaning solution to flow on the front surface of the wafer
Implementation Method 2
a plurality of thermoelectric elements configured to convert the power received from the plurality of power receivers into heat
Implementation Method 3
the spin chuck and the plurality of lower nozzles provide an environment in which a thermophoresis effect or Marangoni convection is formed
Implementation Method 4
the spin chuck and the plurality of lower nozzles provide an environment in which a thermophoresis effect or Marangoni convection is formed
Data Source
AI summary
Provided are a wafer cleaning device and a method of optimizing the same. The wafer cleaning device includes an upper nozzle configured to spray a cleaning solution onto a front surface of a wafer, a spin chuck provided below the wafer to rotate the wafer and configured to heat a central region of the wafer, and a plurality of lower nozzles provided below the wafer to spray a temperature control liquid having a higher temperature than the cleaning solution onto a rear surface of the wafer, the plurality of lower nozzles configured to heat an outer region of the wafer that surrounds the central region of the wafer. A temperature gradient formed by the spin chuck and the plurality of lower nozzles causes a cleaning solution to flow in a cleaning solution layer on the front surface of the wafer.