Spin Chuck Weight Sensing for Precise Substrate Wetting and Drying
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Solution Overview
Problem
Current substrate processing technologies face challenges in precisely controlling the wetting amount during semiconductor fabrication, leading to defects and reduced yield, and are inefficient in the drying process, which increases processing time.
Innovation Solution
A substrate processing chamber equipped with a spin apparatus and weight sensor to measure and control the wetting amount, combined with a drying chamber using supercritical carbon dioxide for efficient drying, allowing real-time monitoring and adjustment of fluid application and drying processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional wetting and drying methods are used, then the processing can be completed, but the wetting amount cannot be precisely controlled leading to substrate defects
Solution Approach 1:
The patent implements a feedback control mechanism where the weight sensor continuously monitors the substrate weight during the wetting process. The controller receives real-time weight data and adjusts the fluid spraying amount accordingly to achieve the target wetting amount, thereby precisely controlling the wetting process and preventing substrate defects
Solution Approach 2:
The patent replaces conventional visual or indirect measurement methods with a weight-based measurement system. The weight sensor directly measures the substrate weight to determine the wetting amount, providing more accurate and reliable control compared to traditional mechanical or visual inspection methods
2Productivity
If conventional drying methods are used, then drying can be performed, but the process is inefficient and increases processing time
Solution Approach 1:
The patent performs preliminary drying action by applying the first drying fluid (nitrogen) immediately after the wetting process to remove excess liquid from the substrate surface. This preliminary drying reduces the subsequent drying burden and accelerates the overall drying process
Solution Approach 2:
The patent changes the drying parameters by using two different drying fluids with different properties: nitrogen for initial rapid drying and supercritical carbon dioxide for final thorough drying. This parameter change approach optimizes the drying efficiency at different stages of the process
3Manufacturing precision
If real-time monitoring of wetting amount is implemented, then precise control is achieved, but the device complexity increases
Solution Approach 1:
The patent implements a self-service measurement system where the weight sensor is integrated into the spin chuck structure. The substrate weight is automatically measured during the normal spinning operation without requiring separate measurement equipment or additional operational steps, thereby reducing system complexity
Solution Approach 2:
The spin chuck serves multiple functions: it holds the substrate, spins the substrate for uniform fluid distribution, and simultaneously measures the substrate weight through the integrated weight sensor. This multi-functionality reduces the need for separate components and simplifies the overall system structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise control of the wetting amount, reduces substrate defects, increases yield, and optimizes the drying process by monitoring and adjusting fluid application in real-time, thereby improving the efficiency and accuracy of semiconductor fabrication.
Implementation Method 1
a weight sensor configured to measure a weight of the substrate supported on the spin chuck
Implementation Method 2
a spin apparatus provided in the housing... a rotation driving part configured to rotate the spin chuck
Implementation Method 3
a fluid spraying nozzle configured to spray fluid into the process space
Implementation Method 4
a drying process may be performed to remove the liquid material from the wafer
Data Source
AI summary
A substrate processing chamber includes a housing providing a process space; a spin apparatus provided in the housing; and a fluid spraying nozzle configured to spray fluid into the process space, wherein the spin apparatus includes: a spin chuck configured to support a substrate; a rotation driving part configured to rotate the spin chuck; and a weight sensor configured to measure a weight of the substrate supported on the spin chuck.