Spin Chuck Weight Feedback for Wafer Wetting Control
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Solution Overview
Problem
Existing substrate processing technologies face challenges in precisely controlling the wetting amount during the wetting process, leading to potential defects and reduced yield in semiconductor fabrication.
Innovation Solution
A substrate processing chamber equipped with a spin apparatus and a fluid spraying nozzle, which includes a weight sensor to measure the substrate's weight and control the wetting amount, along with a drying chamber and a drying fluid supplying part to efficiently perform drying processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fluid spraying nozzle is used to supply liquid material on a wafer, then the wetting process can be performed, but the wetting amount cannot be precisely controlled
Solution Approach 1:
The patent applies feedback control by using a weight sensor to measure the actual weight of the wafer after fluid spraying, comparing it with the target weight, and adjusting the fluid spraying amount accordingly. This closed-loop feedback mechanism enables precise control of the wetting amount by continuously monitoring and correcting the fluid application process.
Solution Approach 2:
The patent replaces traditional mechanical or visual estimation methods for measuring wetting amount with a weight-based measurement system. By substituting the mechanical spraying control with a weight sensor that directly measures the mass change of the wafer, the system achieves more precise and objective control over the wetting amount.
2Productivity
If traditional drying processes are used to remove liquid material from the wafer, then the drying can be performed, but the process time is extended and defects may occur
Solution Approach 1:
The patent changes the parameters of the drying process by using a spin apparatus to rotate the wafer at controlled speeds, thereby changing the centrifugal force and fluid dynamics during drying. This parameter adjustment allows for more efficient liquid removal while maintaining substrate integrity and reducing defect formation.
Solution Approach 2:
The patent employs periodic action through the rotation of the wafer on the spin apparatus during the drying process. The cyclic spinning motion creates periodic centrifugal forces that effectively remove liquid material from the wafer surface, improving drying efficiency while preventing defect formation through controlled, repeated action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables precise control of the wetting amount, reduces substrate defects, increases yield, and minimizes process time by monitoring and adjusting the fluid amount in real-time.
Implementation Method 1
a weight sensor configured to measure a weight of the substrate supported on the spin chuck
Implementation Method 2
a spin apparatus provided in the housing... a spin chuck configured to support a substrate; a rotation driving part configured to rotate the spin chuck
Implementation Method 3
a fluid spraying nozzle configured to spray fluid into the process space
Data Source
AI summary
A substrate processing chamber includes a housing providing a process space; a spin apparatus provided in the housing; and a fluid spraying nozzle configured to spray fluid into the process space, wherein the spin apparatus includes: a spin chuck configured to support a substrate; a rotation driving part configured to rotate the spin chuck; and a weight sensor configured to measure a weight of the substrate supported on the spin chuck.