Spin Coating Edge Inspection for Precise Wafer Bead Removal
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Solution Overview
Problem
The miniaturization of semiconductor devices requires precise control of lithography processes, particularly in spin coating and edge bead removal, to ensure accurate pattern transfer and prevent chip failure due to irregular coating profiles and particle contamination.
Innovation Solution
A semiconductor device manufacturing system incorporating a spin coater and a coating layer inspector, which includes a chuck, coating material dispenser, rotation driver, solution dispenser, edge inspection camera, and inspection controller to form and inspect coating layers, identify exclusion widths, and generate feedback signals for process adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If spin coating process is used to form coating layer on wafer, then coating layer can be formed efficiently, but edge beads are generated on edge portions of wafer causing manufacturing defects
Solution Approach 1:
The invention extracts and removes the harmful edge beads from the coating layer using a solution dispenser that applies solvent to the edge portions of the wafer. This separates the problematic edge bead removal function from the coating formation process, allowing efficient coating while eliminating the resulting defects.
Solution Approach 2:
The invention implements a feedback mechanism where an inspection device detects the coating layer quality and provides information to a control device, which adjusts the solution dispenser operation. This closed-loop control ensures edge beads are removed effectively while maintaining overall coating layer quality.
2Manufacturing precision
If edge bead removal is performed by dispensing solution on edge portion of wafer, then edge beads can be removed, but coating layer may be damaged or particles may contaminate the wafer
Solution Approach 1:
The inspection device monitors the coating layer and wafer surface in real-time during the edge bead removal process. The control device uses this feedback information to adjust the solution dispenser parameters, preventing over-removal that could damage the coating layer or introduce particles.
Solution Approach 2:
The invention dynamically changes the dispensing parameters (flow rate, position, timing) of the solution dispenser based on feedback from the inspection device. This precise parameter control ensures effective edge bead removal while minimizing the risk of coating layer damage and particle contamination.
3Measurement precision
If inspection device captures images of entire wafer surface, then complete coating layer inspection is achieved, but image processing time and complexity increase significantly
Solution Approach 1:
The inspection device extracts and inspects only the critical edge portions of the coating layer where edge beads are most likely to form. This selective inspection approach reduces the imaging and processing workload while maintaining detection effectiveness for the most problematic areas.
Solution Approach 2:
The invention applies different inspection strategies to different regions of the wafer. Edge portions receive detailed inspection for edge bead detection, while the central region receives less intensive inspection, optimizing the balance between inspection completeness and processing efficiency.
4Productivity
If solution dispenser is positioned close to edge portion of wafer for effective edge bead removal, then edge bead removal efficiency improves, but risk of solution contamination and coating layer damage increases
Solution Approach 1:
The control device dynamically adjusts the positioning and dispensing parameters of the solution dispenser based on feedback from the inspection device. This allows the system to maintain optimal proximity for effective edge bead removal while preventing the solution from contacting and damaging the coating layer or introducing particles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the reliability of semiconductor device manufacturing by ensuring precise coating layer formation, reducing chip failures, and enhancing production yield by accurately removing edge beads and maintaining alignment, thus optimizing the number of chips per wafer.
Implementation Method 1
a rotation driver configured to rotate the chuck such that the coating material is coated on the wafer to form the coating layer
Implementation Method 2
a solution dispenser configured to dispense a solution to a portion of the coating layer formed on an edge portion of the wafer
Implementation Method 3
an edge inspection camera configured to obtain a plurality of images of edge portions of the wafer
Data Source
AI summary
A semiconductor device manufacturing system includes a spin coater and a coating layer inspector. The spin coater includes: a chuck, a rotation driver configured to rotate the chuck; and a solution dispenser configured to spray a solution onto a portion of the coating layer formed on an edge portion of the wafer, wherein the coating layer inspector includes an edge inspection camera and an inspection controller configured to determine a radius, eccentricity, and a top-view shape of the coating layer, based on images of the edge portion of the wafer.