Spin Coating Film Quality Control Using Distributed SPC Imaging
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Solution Overview
Problem
Existing spin coating processes lack real-time monitoring and control capabilities to ensure uniformity and quality of the film, leading to potential defects and inefficiencies.
Innovation Solution
The implementation of a system that uses distributed Single Pixel Cameras (SPCs) and Spatial Light Modulators (SLMs) to capture high-frame-rate images of the film in real-time, enabling in-situ quality prediction and dynamic adjustment of spin coating parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional imaging devices are used to monitor film quality, then the system structure is simple, but real-time monitoring capability is insufficient and frame rate is low
Solution Approach 1:
The imaging system is segmented into multiple independent Single Pixel Cameras (SPCs) that capture different spatial regions of the film simultaneously. Each SPC operates as an independent imaging unit, allowing parallel capture of multiple film regions, which enables real-time monitoring while keeping each individual camera unit simple in structure.
Solution Approach 2:
The system transitions from traditional single-pixel point measurement to a multi-dimensional imaging approach by distributing multiple SPCs across different spatial positions and angles. This dimensional expansion allows simultaneous capture of multiple film regions, achieving real-time monitoring capability without requiring complex mechanical scanning systems.
2Measurement precision
If high frame rate imaging is implemented, then real-time quality assessment is enabled, but data processing complexity increases
Solution Approach 1:
Instead of processing raw high-volume image data, the system creates simplified copies or representations of film quality characteristics. The SPCs capture essential optical properties (transparency, viscosity indicators) that are then processed as reduced data sets, maintaining measurement precision while significantly lowering data processing complexity compared to full-image analysis.
3Measurement precision
If multiple imaging devices are used to capture different film regions, then comprehensive quality monitoring is achieved, but system complexity and cost increase
Solution Approach 1:
The system replaces complex mechanical scanning or moving camera systems with a static array of multiple Single Pixel Cameras. This substitution eliminates mechanical complexity while achieving comprehensive spatial coverage through the distributed SPC arrangement, allowing simultaneous capture of multiple film regions without moving parts.
4Manufacturing precision
If real-time parameter adjustment is implemented, then film uniformity is improved, but process control complexity increases
Solution Approach 1:
The system implements a feedback control mechanism where the optical measurements from SPCs are continuously monitored and fed back to adjust spin coating parameters in real-time. This feedback loop enables automatic process control that maintains film uniformity without requiring complex manual intervention or overly sophisticated control algorithms, as the system self-regulates based on real-time optical quality indicators.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for real-time assessment and control of film quality, ensuring optimal uniformity and reducing defects, while also optimizing the spin coating process parameters.
Implementation Method 1
The imaging device may include SPCs and lens and/or Spatial Light Modulators (SLMs). Due to not using any mechanical parts such as a camera shutter, the imaging device may capture the images of the portions of the film in a high frame rate based on a sampling rate to capture the images.
Implementation Method 2
Spin coating is a coating technique used in a semiconductor wafer manufacturing process to uniformly deposit a liquid (e.g., a photoresist, a developer, and/or a solvent) onto a substrate (e.g., a semiconductor substrate or a wafer) as a thin film using a centrifugal force and a liquid-vapor interface.
Implementation Method 3
Spin coating is a coating technique used in a semiconductor wafer manufacturing process to uniformly deposit a liquid (e.g., a photoresist, a developer, and/or a solvent) onto a substrate (e.g., a semiconductor substrate or a wafer) as a thin film using a centrifugal force and a liquid-vapor interface.
Implementation Method 4
The system may scan the film in real-time, may enable in-situ quality prediction of the film, and may control parameters of the spin coating process to form the film having an acceptable or desirable quality (e.g., optimal quality) of the film.
Implementation Method 5
The exposure of the invisible light spectrum (e.g., infra-red) may expose many hidden or extra characteristics such as a relative viscosity of the film different locations or areas of the film, which may be invisible under the exposure of the visible light spectrum.
Data Source
AI summary
Example embodiments may provide methods for determining a quality of a film in spin coating process. The methods may include capturing images of portions of the film using an imaging device while coating the film on a substrate using a spinner. The imaging device may include SPCs and lens and/or SLMs. The methods may also include determining whether a characteristic of the film matches to a standard based on the images of the portions of the film. The method may further include performing detecting that the quality of the film is optimal in response to determining that the characteristic of the film matches to the standard or detecting that the quality of the film is not optimal in response to determining that the characteristic of the film does not match to the standard.