Spin-Coating Fluid Velocity Tracking for Pattern Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional spin-on processes for semiconductor substrates face adverse local fluid dynamic effects, such as pattern collapse and critical dimension issues, due to uncontrolled local fluid dynamics during processing.
Innovation Solution
The method involves introducing a perturbation, like a localized thermal change or surface wave, into the processing liquid on a spinning substrate to track its movement and determine localized fluid velocity, which is then used to control operational parameters like flow rate and rotational speed to mitigate these effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional spin-on processes are used with uncontrolled fluid dynamics, then the processing can be performed with simple equipment, but pattern collapse and critical dimension issues occur
Solution Approach 1:
The patent implements feedback control by measuring fluid velocity using tracer particles and using this information to adjust processing parameters. The system continuously monitors fluid dynamics and adjusts spin speed or flow rate to prevent pattern collapse while maintaining manufacturing simplicity
Solution Approach 2:
The patent replaces direct mechanical control of fluid dynamics with optical measurement and computational analysis. By using particle tracking and image processing to measure fluid velocity, the system substitutes complex mechanical sensing with optical fields and computational methods
2Manufacturing precision
If operational parameters are adjusted to control fluid dynamics, then manufacturing precision improves, but process complexity increases
Solution Approach 1:
The system performs self-diagnosis and self-adjustment by automatically measuring fluid velocity and using this information to control its own processing parameters. The measurement and control are integrated into a single automated system that requires minimal external intervention
Solution Approach 2:
The patent dynamically adjusts processing parameters such as spin speed and flow rate based on real-time fluid velocity measurements. By changing these parameters in response to measured conditions, the system maintains precise critical dimension control while adapting to varying process conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively controls local fluid dynamics, preventing pattern collapse and maintaining accurate critical dimensions by dynamically adjusting operational parameters based on real-time fluid velocity measurements.
Implementation Method 1
an optical sensor coupled to track movement of a perturbation induced within the processing liquid
Data Source
AI summary
Systems and methods are provided to control operational parameter(s) of a spin-on process based on a localized fluid velocity of a processing liquid dispensed onto a surface of a spinning semiconductor substrate. In the present disclosure, a perturbation is introduced within a processing liquid dispensed onto the spinning semiconductor substrate. Movement of the perturbation is tracked over time, as the perturbation flows along with the processing liquid across the spinning substrate surface, to determine a localized fluid velocity of the processing liquid at one or more radial positions on the substrate surface. The localized fluid velocity is then used to control one or more operational parameters of a spin-on process.