Spin Cup Cleaning With Moving Nozzles for Wider Inclined-Surface Coverage
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in effectively broadening the cleaning range of the cup to remove deposits and residues from the inclined surface, which can lead to inefficiencies and potential contamination.
Innovation Solution
A method involving the use of multiple nozzles that supply processing liquids to the substrate's central and peripheral areas while rotating, combined with a moving mechanism to adjust the nozzle position and direction, enhances the cleaning range by ensuring thorough coverage and efficient removal of residues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single nozzle supplies cleaning liquid to the substrate periphery, then the device structure is simple, but the cleaning range of the cup inclined surface is limited
Solution Approach 1:
The liquid supply unit is divided into multiple nozzles (first nozzle, second nozzle, third nozzle, fourth nozzle) positioned at different locations and orientations. Each nozzle targets specific regions of the substrate and cup inclined surface, enabling comprehensive cleaning coverage without requiring a single complex nozzle system.
Solution Approach 2:
The nozzles are arranged in multiple spatial dimensions - radially outward from the substrate center, at different heights, and with different orientations (inclined downward, horizontal, inclined upward). This multi-dimensional arrangement allows the cleaning liquid to reach various portions of the cup inclined surface effectively.
2Area of stationary object
If the nozzle remains stationary, then the device structure is simple, but the cleaning coverage on the rotating substrate is insufficient
Solution Approach 1:
The liquid supply unit incorporates a moving mechanism that enables the nozzles to move in the radial direction relative to the substrate center. This dynamic adjustment allows the nozzles to track and clean different portions of the rotating substrate and cup inclined surface, maximizing cleaning coverage while maintaining a relatively simple mechanical structure.
3Reliability
If processing liquid is supplied only to the substrate top surface, then the liquid supply system is simple, but deposits on the cup inclined surface are not effectively removed
Solution Approach 1:
Different nozzles are positioned and oriented to supply processing liquid to specific local regions: the first nozzle supplies liquid to the substrate top surface center region, the second nozzle to the periphery, the third nozzle to the bottom surface, and the fourth nozzle to the cup inclined surface. This localized quality approach ensures effective deposit removal from each specific area.
Solution Approach 2:
The liquid supply function is segmented into multiple nozzles, each responsible for a specific cleaning task. The fourth nozzle specifically targets the cup inclined surface, ensuring that deposits in this area are effectively removed without requiring all nozzles to be positioned for this purpose.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a wider and more effective cleaning of the cup's inclined surface, reducing residue buildup and improving the overall cleaning efficiency of the substrate processing apparatus.
Implementation Method 1
a spin chuck configured to hold a substrate horizontally and rotate it around a rotation axis... The cup has an inclined surface that enlarges in a diametrical direction downwardly along the rotation axis. The substrate processing apparatus supplies a cleaning liquid to the spin chuck being rotated, thus allowing the cleaning liquid to be scattered to be supplied to the inclined surface of the cup.
Data Source
AI summary
A cleaning method includes (A) and (B) described below. (A) A first processing liquid is supplied to a central portion of a top surface of a substrate from a first nozzle and, also, a second processing liquid is supplied to a periphery of the top surface of the substrate from a second nozzle in a state that the substrate is horizontally held inside a cup and the substrate is rotated in a first direction about a vertical rotation shaft. (B) During a discharge of the second processing liquid by the second nozzle, the second nozzle is moved in a diametrical direction of the substrate between a first position where a discharge line of the second nozzle touches the periphery of the top surface of the substrate and a second position where the discharge line of the second nozzle deviates from the substrate.