Spin Dispenser Vacuum Ejectors for Substrate Surface Protection
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Solution Overview
Problem
In the lithography process for manufacturing integrated circuits, the deposition and accumulation of organic compounds on semiconductor substrates during and after coating and developing processes lead to defects, which are not effectively prevented by conventional methods as feature sizes decrease.
Innovation Solution
A spin dispenser module with a rotatable platform and vacuum chuck, equipped with a liquid dispenser and ejector inlets connected to a negative pressure source, which applies controlled suction to remove gaseous and solid particles from the substrate surface, preventing unwanted deposition of organic materials during and after coating and developing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional coating and developing processes are used, then the lithography process can proceed, but organic compounds deposit and accumulate on the substrate surface causing defects
Solution Approach 1:
The system performs preliminary action by applying a protective coating to the substrate surface before the harmful deposition occurs. This protective layer prevents organic compounds from accumulating during the coating and developing processes, thereby maintaining coating quality without causing defects.
Solution Approach 2:
The patent introduces an intermediary substance (protective coating material) that acts as a barrier between the substrate surface and the organic compounds present during lithography processes. This intermediary layer allows the coating and developing processes to proceed while preventing harmful deposition on the substrate.
2Productivity
If feature sizes are reduced for advanced integrated circuits, then circuit density increases, but coating and developing quality becomes more critical as defects form more easily
Solution Approach 1:
By applying the protective coating before the lithography process, the system ensures that even as feature sizes decrease and coating quality becomes more critical, the substrate surface remains protected from organic compound deposition that would cause defects in high-precision manufacturing.
Solution Approach 2:
The patent changes the surface condition parameter of the substrate by applying a protective coating, which modifies how the substrate interacts with coating and developing materials. This parameter change enables maintaining manufacturing precision even as feature sizes are reduced for higher circuit density.
3Ease of operation
If the substrate remains in the spin dispenser module after coating, then processing can continue, but organic material accumulates on the substrate surface
Solution Approach 1:
The protective coating is applied in advance before the substrate remains in the spin dispenser module during subsequent processing steps. This preliminary protection allows processing continuity while preventing organic material accumulation that would occur without the protective layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the spin dispenser module significantly reduces defects by removing suspended particles, achieving a 75% or more reduction in organic compound deposition, thereby improving coating quality and reducing defect counts from 25 to 5 or 70 to 20 defects per test area.
Implementation Method 1
ejector inlets connected to a negative pressure source, which applies controlled suction to remove gaseous and solid particles from the substrate surface
Implementation Method 2
A substrate is chucked on a rotatable platform
Data Source
AI summary
A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.