Spin Head Bottom Cleaning to Prevent Substrate Processing Defects
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Solution Overview
Problem
Residual processing solutions and by-products from chemical reactions on a spin head in semiconductor processing can lead to defects in subsequent substrate processing, as they often remain and attach to the equipment.
Innovation Solution
A substrate processing apparatus and method that includes a spin head with a bottom cleaning member, featuring support arms and nozzles to spray cleaning solutions onto the spin head and container, ensuring thorough cleaning of residual chemicals and by-products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a spin head is used to process substrates with processing solutions, then substrate processing can be performed, but residual processing solutions and by-products remain on the spin head causing defects in subsequent processing
Solution Approach 1:
The cleaning solution is supplied to the spin head before the actual substrate processing begins. This preliminary cleaning action removes any residual processing solutions or by-products that might have accumulated, ensuring that the spin head is clean before new processing starts, thus preventing defects in subsequent substrates
Solution Approach 2:
A cleaning solution is introduced as an intermediary substance between substrate processing steps. This cleaning solution acts as a mediator to remove contaminants from the spin head without damaging it, enabling transition from one processing step to the next clean state
2Reliability
If cleaning solutions are sprayed onto the spin head, then residual chemicals are removed, but additional cleaning steps are required in the processing cycle
Solution Approach 1:
The spin head structure is designed to serve multiple functions: it can rotate substrates for processing, receive cleaning solutions, and facilitate drying. The same spin head mechanism that processes substrates is also used to distribute cleaning solutions and remove them via rotation, eliminating the need for separate dedicated cleaning mechanisms
Solution Approach 2:
The spin head cleans itself by rotating during the cleaning process. The rotation of the spin head distributes the cleaning solution uniformly across its surface and then removes it through centrifugal force, allowing the spin head to perform its own cleaning without external intervention beyond the initial solution supply
3Productivity
If the spin head rotates at high speed during processing, then substrate processing efficiency is improved, but residual processing solutions are more likely to attach to the spin head
Solution Approach 1:
The cleaning process is implemented periodically between substrate processing steps. The spin head undergoes cycles of substrate processing followed by cleaning cycles where cleaning solution is supplied and then removed through rotation. This periodic cleaning prevents accumulation of residuals that would occur with continuous high-speed operation alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes residual processing solutions and by-products from the spin head and container, preventing defects in subsequent substrate processing and maintaining equipment cleanliness.
Implementation Method 1
a bottom cleaning member located to be a certain distance from the bottom of the spin head, wherein the bottom cleaning member sprays a cleaning solution to the bottom of the spin head
Data Source
AI summary
Provided is an apparatus for processing a substrate including a spin head on which a substrate is placed, a container provided to surround the spin head, an upper nozzle member supplying a processing solution downwards, a bottom cleaning member located to be a certain distance from the bottom of the spin head, wherein the bottom cleaning member sprays a cleaning solution to the bottom of the spin head.