Spin Head Chuck Pin Thermal Management
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Solution Overview
Problem
The existing substrate treatment processes face inefficiencies due to temperature disparities on the substrate surface during cleaning, particularly where chuck pins and supporting pins contact the substrate, leading to lower cleaning efficiency in those areas compared to the rest of the substrate.
Innovation Solution
A spin head with chuck pins and supporting pins featuring materials with optimized heat conductivity and thermal resistance, designed to match the chemical and temperature requirements of the treatment process, ensuring even treatment across the substrate surface by using ceramic and resin materials like silicon carbide and perfluoralkoxy (PFA) for the pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If chuck pins and supporting pins are used to support the substrate during treatment, then the substrate can be held and processed, but temperature disparities occur at the contact areas leading to lower cleaning efficiency
Solution Approach 1:
The patent applies local quality by using pins with different material properties (ceramic vs. resin) at different locations or for different functions. The ceramic portion provides thermal stability where heat resistance is needed, while the resin portion provides thermal insulation where heat blocking is needed, creating localized thermal characteristics that prevent temperature disparities on the substrate surface.
Solution Approach 2:
The patent uses composite materials by combining ceramic and resin materials in the pin structure. This composite approach allows the pin to simultaneously provide mechanical support, thermal stability, and thermal insulation properties, resolving the contradiction between substrate handling capability and cleaning uniformity by controlling heat transfer characteristics.
2Adaptability or versatility
If treatment liquid with various temperatures is supplied to the substrate, then different treatment processes can be performed, but temperature differences cause non-uniform treatment at pin contact areas
Solution Approach 1:
The patent implements local quality by designing pins with differentiated thermal properties (ceramic for heat resistance, resin for heat insulation) that create localized thermal zones. This allows the substrate to undergo various temperature-based treatments while maintaining uniform temperature distribution across the substrate surface, even at pin contact areas.
Solution Approach 2:
The patent applies parameter changes by modifying the thermal parameters (heat conductivity, thermal resistance) of the pin materials. By selecting materials with specific thermal properties, the system can accommodate different treatment liquid temperatures while maintaining treatment uniformity, thus enabling process versatility without sacrificing precision.
3Device complexity
If single-material pins are used for substrate support, then the structure is simple, but heat conductivity cannot be optimized for different chemical and temperature requirements
Solution Approach 1:
The patent applies local quality by using different materials (ceramic and resin) in different portions of the pin structure. This allows optimization of heat conductivity and thermal resistance at specific locations within the pin, enabling the system to meet different chemical and temperature requirements without significantly increasing overall structural complexity.
Solution Approach 2:
The patent uses composite materials to combine the advantages of ceramic (heat resistance, chemical stability) and resin (thermal insulation, chemical resistance) in a single pin structure. This composite approach provides optimized heat conductivity characteristics for different treatment conditions while maintaining reasonable structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the efficiency of the substrate treatment process by providing optimized heat conductivity and thermal resistance, ensuring uniform treatment and improved cleaning performance across the entire substrate surface.
Implementation Method 1
one of the first material and the second material has a lower heat conductivity and a better thermal resistance than the other of the first material and the second material
Implementation Method 2
one of the first material and the second material has a lower heat conductivity and a better thermal resistance than the other of the first material and the second material
Data Source
AI summary
The present disclosure relates to a spin head, apparatus and method for treating a substrate including the spin head. The spin head includes a supporting plate where a substrate is placed and a chuck pin placed on the supporting plate and supporting a lateral portion of the substrate, wherein the chuck pin includes an outer body and an inner body inserted in the outer body and provided with a different material from the outer body, wherein each outer body and the inner body is provided with any one of a first material or a second material, and wherein one material of the first material and the second material is provided with a material having lower heat conductivity and better thermal resistance than another one.