Spin Head Chucking Pin Rotation for Solution Residue Prevention
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Solution Overview
Problem
In semiconductor substrate processing, existing spin cleaners face efficiency degradation due to treating solutions remaining on the substrate where chucking pins contact it, leading to contamination and reduced process efficiency.
Innovation Solution
A spin head with a ring-shaped chucking/unchucking mechanism and a driving unit that rotates chucking pins at a predetermined angle, allowing selective variation of contact points, utilizing a lifting member and movement conversion member to convert up-down movement into rotation, enabling alternating use of first and second chucking pins to prevent solution residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chucking pins continuously contact one portion of the substrate during the process, then the substrate can be held securely, but treating solutions remain at the contact portion and contaminate the substrate
Solution Approach 1:
The chucking pins are made rotatable around the substrate circumference, transforming from a static contact point to a dynamic system where the contact position changes continuously during substrate processing, preventing solution accumulation at any single location
Solution Approach 2:
The chucking pins perform periodic rotation to alternate contact points on the substrate edge, creating a cyclical pattern of contact that distributes any potential contamination across multiple locations rather than concentrating it at one spot
2Device complexity
If chucking pins remain stationary at one location, then the mechanical holding structure is simple, but treating solutions harden and act as debris after the process
Solution Approach 1:
The chucking pins incorporate a rotation mechanism that allows them to move dynamically around the substrate, preventing treating solutions from hardening at a fixed location and forming debris that would contaminate the substrate and periphery
3Ease of operation
If chucking pins continuously contact the same substrate portion, then the chucking mechanism is simple to operate, but process efficiency degrades due to solution remaining
Solution Approach 1:
The system implements periodic rotation of chucking pins to different contact positions on the substrate, creating a cyclical chucking-unchucking pattern that prevents solution accumulation and maintains high process efficiency throughout substrate treatment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents treating solutions from remaining on the substrate, thereby enhancing process efficiency by reducing contamination and improving substrate handling during cleaning and drying processes.
Implementation Method 1
a movement conversion member configured to convert up-down movement of the lift member to rotation movement of the chucking pins
Implementation Method 2
A spin cleaner rotates a semiconductor substrate at a predetermined speed and injects a treating solution
Implementation Method 3
a method of vacuum-absorbing the treated surface of a substrate to hold the substrate
Data Source
AI summary
A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.