Spin-On Carbon Composition for Reflow-Controlled Crosslinking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor manufacturing is the reflow and uneven coverage of spin-on carbon (SOC) layers during thermal crosslinking, which can lead to damage to substrates and features during subsequent processing operations.
Innovation Solution
A two-step heating process is employed to thermally crosslink the SOC layer, where the first heating at a lower temperature partially crosslinks the layer, followed by a second heating at a higher temperature to fully crosslink it, reducing reflow and ensuring even coverage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single high-temperature heating process is used to crosslink the SOC layer, then crosslinking efficiency is improved, but SOC layer reflow occurs causing uneven coverage and substrate damage
Solution Approach 1:
The single high-temperature heating process is segmented into two distinct heating stages: a first heating process at a lower temperature range and a second heating process at a higher temperature range. This segmentation allows the SOC layer to be gradually crosslinked without excessive reflow, maintaining coverage uniformity while achieving complete crosslinking. The first heating process partially crosslinks the SOC layer with minimal reflow, and the second heating process completes the crosslinking with controlled reflow.
2Productivity
If heating temperature is increased to accelerate crosslinking, then processing speed is improved, but SOC layer reflow increases causing substrate damage
Solution Approach 1:
The first heating process serves as a preliminary action that partially crosslinks the SOC layer before the second high-temperature heating process. This preliminary crosslinking creates a more stable SOC layer structure that resists reflow during the subsequent high-temperature heating, enabling faster processing without substrate damage. The preliminary action of partial crosslinking prepares the SOC layer to withstand the harsher conditions of the second heating process.
3Reliability
If heating temperature is increased to ensure complete crosslinking, then crosslinking completeness is improved, but SOC layer reflow causes uneven thickness
Solution Approach 1:
The heating process is segmented into two stages with different temperature ranges: the first heating process at a lower temperature (e.g., 200-300°C) maintains SOC layer thickness uniformity by minimizing reflow, while the second heating process at a higher temperature (e.g., 300-450°C) ensures complete crosslinking. The segmentation allows each heating stage to optimize for its specific purpose without compromising the other.
Solution Approach 2:
The heating temperature parameter is changed between two distinct ranges in sequence. The first heating process uses a moderate temperature parameter that balances crosslinking with reflow control, while the second heating process uses a higher temperature parameter optimized for complete crosslinking. This parameter change strategy allows the process to achieve both uniform thickness and complete crosslinking by adapting the temperature parameter to the specific requirements of each heating stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively inhibits SOC layer reflow, preventing substrate damage and ensuring consistent coverage, thereby improving the reliability and precision of semiconductor manufacturing processes.
Implementation Method 1
The spin on carbon layer is first heated at a first temperature to partially crosslink the spin on carbon layer. The spin on carbon layer is second heated at a second temperature to further crosslink the spin on carbon layer.
Data Source
AI summary
A composition, comprising: a carbon backbone polymer; a first crosslinker; and a second crosslinker. The first crosslinker partially crosslinks the carbon backbone polymer at a temperature ranging from 100° C. to 170° C., and the second crosslinker crosslinks the carbon backbone polymer at a temperature ranging from 180° C. to 300° C. The first crosslinker is one or more selected from the group consisting of A-(OR)x, A-(NR)x,where A is a monomer, oligomer, or a second polymer having a molecular weight ranging from 100 to 20,000, R is an alkyl group, cycloalkyl group, cycloalkylepoxy group, or C3-C15 heterocyclic group, OR is an alkyloxy group, cycloalkyloxy group, carbonate group, alkylcarbonate group, alkyl carboxylate group, tosylate group, or mesylate group, NR is an alkylamide group or an alkylamino group, and x ranges from 2 to 1000. The second crosslinker is different from the first crosslinker.