Solid-State Spin Sensor Mounting with SiC Heat Spreader
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current solid-state spin sensors face challenges in efficiently removing heat, delivering microwave radiation, and minimizing noise and interference, particularly when used in biological applications, due to the limitations of electrically conductive materials and vibration susceptibility.
Innovation Solution
An integrated mounting solution using semi-insulating silicon carbide as a high-thermal-conductivity heat spreader with a microwave application structure and light couplers, which maintains mechanical stiffness and allows for efficient heat dissipation and microwave delivery without interfering with optical measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an electrically conductive material (e.g., metal) is used as a heat sink or heat spreader, then thermal conductance is improved, but microwave radiation delivery is interfered with
Solution Approach 1:
The patent introduces a dielectric layer as an intermediary between the conductive heat sink and the sensor crystal. This dielectric layer has low electrical conductivity to allow microwave radiation to pass through while maintaining thermal conductivity to transfer heat away from the sensor. The dielectric layer thus mediates between the conflicting requirements of heat dissipation and microwave delivery.
Solution Approach 2:
The patent employs a composite structure combining a conductive heat sink material with a dielectric layer. This composite material system leverages the high thermal conductivity of the conductive material while the dielectric component ensures microwave transparency, resolving the contradiction between thermal management and microwave delivery requirements.
2Temperature
If an electrically conductive material is used as a heat sink, then thermal conductance is improved, but biological activity is interfered with and toxicity may occur
Solution Approach 1:
The dielectric layer serves as a protective intermediary between the conductive heat sink and biological samples. It prevents direct contact between conductive materials and biological tissues, eliminating concerns about electrical interference with neural activity and chemical toxicity, while still allowing effective heat dissipation through the layer.
Solution Approach 2:
The patent employs a thin dielectric layer that can be easily replaced or removed, providing a non-invasive interface between the heat sink and biological samples. This approach avoids permanent implantation of conductive materials that could cause long-term biological harm, while maintaining effective thermal management.
3Measurement precision
If the mounting configuration is made robust and stiff to reduce vibration noise, then measurement noise is reduced, but thermal conductance may be compromised
Solution Approach 1:
The patent divides the mounting structure into separate functional segments: a stiff mechanical support structure for vibration isolation and a separate dielectric layer for thermal management. This segmentation allows each component to be optimized for its specific function without compromising the other, achieving both mechanical stability and thermal conductance.
Solution Approach 2:
The patent uses a composite mounting structure combining mechanically stiff materials with thermally conductive dielectric materials. This composite design provides the necessary mechanical rigidity to reduce vibration noise while maintaining adequate thermal pathways for heat dissipation from the sensor crystal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively mitigates temperature fluctuations, reduces noise, and enhances the sensitivity of solid-state spin sensors by providing a robust and efficient thermal management system that does not interfere with microwave radiation delivery or biological samples.
Implementation Method 1
the mounting structure is in thermal contact with the solid-state spin sensor such that thermal energy flows from the solid-state spin sensor to the mounting structure
Implementation Method 2
a microwave application structure, disposed on a face of the mounting structure or a face of the solid-state spin sensor for applying microwave radiation to the solid-state spin sensor
Data Source
AI summary
Solid-state spin sensor systems and methods of manufacturing are disclosed. A mounting structure may be provided in thermal contact with a solid-state spin sensor having a plurality of color center defects such that thermal energy flows from the solid-state spin sensor to the mounting structure. A microwave application structure may be disposed on a face of the mounting structure or a face of the solid-state spin sensor for applying microwave radiation to the solid-state spin sensor.