Spin Substrate Treatment Liquid Discharge Control
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Solution Overview
Problem
In spin substrate treatment processes, treatment liquids can become stagnant, leading to sediment formation and reduced treatment performance, such as etching rate and cleaning ability, due to particle deposition.
Innovation Solution
A substrate treatment apparatus and method that includes a controller to periodically increase the rotation speed and liquid discharge velocity during treatment, promoting liquid discharge and replacing stagnant treatment liquid with new liquid, while maintaining uniform treatment conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If treatment liquid is continuously supplied during spin substrate treatment, then treatment performance is maintained, but liquid stagnation occurs leading to particle deposition and sediment formation
Solution Approach 1:
The patent applies periodic action by interrupting the continuous supply of treatment liquid at predetermined intervals during spin substrate treatment. This periodic interruption prevents liquid stagnation and particle deposition while maintaining treatment performance. The controller stops the supply of treatment liquid periodically, allowing the liquid to be discharged from the substrate without adding new liquid, thereby eliminating the harmful effect of sediment formation.
2Object-generated harmful factors
If treatment liquid supply is interrupted to prevent sediment, then particle deposition is reduced, but treatment uniformity deteriorates
Solution Approach 1:
The periodic interruption of treatment liquid supply is designed to maintain treatment uniformity by preventing sediment formation. The predetermined timing of interruptions ensures that liquid is discharged before significant particle deposition occurs, while the substrate rotation continues to maintain uniform distribution. This balanced approach preserves both treatment uniformity and prevents harmful sediment accumulation.
Solution Approach 2:
The system incorporates feedback control where the controller monitors treatment conditions and adjusts the timing of liquid supply interruptions accordingly. By detecting changes in treatment state, the controller optimizes the interruption timing to maintain uniform treatment while preventing sediment formation, creating a self-regulating system that adapts to varying conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents particle deposition and maintains treatment efficiency by ensuring continuous liquid replacement and uniformity, improving the treatment performance without requiring new equipment.
Implementation Method 1
substrate is rotated, a treatment liquid is supplied from a nozzle opposed to the substrate surface onto the substrate surface, and the treatment liquid is spread on the substrate surface by centrifugal force of rotation
Implementation Method 2
controller performing liquid discharge treatment to change liquid discharge velocity at which the treatment liquid is discharged from the substrate, at preset predetermined timing
Data Source
AI summary
According to an embodiment, a substrate treatment apparatus includes, a substrate support unit supporting a substrate, a rotary unit rotating the substrate, a treatment liquid supply unit supplying treatment liquid to a surface of the substrate, and a controller performing liquid discharge treatment to change liquid discharge velocity at which the treatment liquid is discharged from the substrate, at preset predetermined timing, during substrate treatment in which the treatment liquid is supplied while the substrate is rotated, with the treatment continued.